Alpha Assembly Solutions Inc.

Sarnoff Corporation

Delsys Pharmaceutical Corporation

Other

Fry's Metals, Inc.

Alpha Metals, Inc.

David Sarnoff Research Center, Inc.

Lightmatrix Technologies, Inc.

Macdermid Autotype Limited

Alliedsignal Inc.

Specialty Coating Systems, Inc.

Consortium for Surface Processing, Inc.

Association Institutions for Material Sciences, Inc.

Alpha Assembly Solution Inc.

Alpha Fry Limited

Bawa Singh

Oscar Khaselev

Nitin Vithalbhai Desai

Siuli Sarkar

Michael T Marczi

Ranjit Pandher

Rahul Raut

William Ronald Roach

Brian Lewis

Sutapa Mukherjee

Monnir Boureghda

Hoi Cheong Sun

Anna Lifton

Howard Christopher Rivenburg

Ravi Bhatkal

Eugene Samuel Poliniak

Anubhav Rustogi

Narahari Pujari

Peter John Zanzucchi

Nirmalya Kumar Chaki

Morgana De Avila Ribas

David A Keller

Joseph Thomas McGinn

Michael James Liberatore

Peter David Southgate

Suggy S Chrai

Sanyogita Arora

Zvi Gerald Loewy

Sathish Kumar

Gerard R Minogue

Pabitra Datta

Satyam Choudary Cherukuri

Ellen Schwartz Tormey

Aaron W Levine

Attiganal Narayanaswamy Sreeram

Zilan Shen

Leszek Hozer

William Chiang

Mohamed Emam Labib

Anil Kv Kumar

Grzegorz Kaganowicz

James Harold Atherton

Arthur Herbert Firester

James Regis Matey

Andreas Greiner

Robert H Detig

Dennis John Bechis

Herschel Clement Burstyn

Peter James Coyle

Olaf Kriha

Phillip Hanefeld

Dominic Stephen Rosati

Nalin Kumar

Bin Mo

Remya Chandran

John P Laughlin

Ravindra Mohan Bhatkal

Lawrence Harrison Hammer

Barun Das

Pavan Vishwanath

Vipulkumar K Patel

Pritha Choudhury

Ashok Pachamuthu

Anthony E Ingham

Supriya Devarajan

Chetan Pravinchandra Shah

Shamik Ghosal

Hoi Cheong Steve Sun

Keith Paul Parsons

Bogdan Brycki

Shamik Ghoshal

Ali Ouali

Anna Jane Harris

Sachin Parashar

John Henry Thomas, Iii

Krishna Linga

Jeffrey William Braham

David V Kyaw

Ramakrishna Hosur Venkatagiriyappa

Harish Hanchina Siddappa

Steven Dane Prokopiak

Dietmar C Eberlein

Rakesh Kumar

Ramaswamy Murari

Donald Barry Carlin

Gary Santonastaso

Israel Haim Kalish

Daniel Goswami

Morgana Ribas

Martinus N Finke

Nicholas G Herrick

Eugene Samuel Puliniak

Gerard Campbell

Hoi Cheong (Steve) Sun

Prince Lal

Supriya Deverajen

Amit Patel

William Yat Chung Chiang

Dominic S Rosati

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering powder

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

Stretchable interconnects for flexible electronic surfaces

A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

Applications of engineered graphene

A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

Nano copper paste and film for sintered die attach and similar applications

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Methods for attachment and devices produced using the methods

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

Advanced solder alloys for electronic interconnects

A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

Composite and multilayered silver films for joining electrical and mechanical components

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering paste

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Voorhees, NJ, United States of America

Bawa Singh