Diodes Inc.

Bau Shun Huang

Pin-Hao Huang

Tim C Chen

Yeng-Liang Lin

A rectifier package is provided, which comprises a first rectifier die having an anode and a cathode conductively bonded to a first conductive film on a first surface. The rectifier package also comprises a second rectifier die having an anode and a cathode conductively bonded to the first conductive film on a second surface, which is opposite to the first surface. The first conductive film is in contact with both anodes or both cathodes of the first rectifier die and the second rectifier die.

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Taipei, Taiwan

Bau Shun Huang