Stmicroelectronics S.r.l.

Battista Vitali

Mauro Mazzola

Matteo De Santa

Lo&iuml;c Renard

Alessandro Frontero

A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.

Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package

A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

Thermosonically bonded connection for flip chip packages

A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is substantially frustum-shaped. The body has a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device. The portion of the body that is adjacent a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allows formation of a substantially flat annular peripheral region on a copper ball when the copper ball is placed at a lower end of the copper wire. The copper ball is deformed by the action of the capillary. The formation of the substantially flat annular peripheral region is independent of the position of the copper wire within the through hole of the body of the capillary.

Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device

A method for forming and bonding a metal bump on a metal pad of an integrated circuit and successively stamping a vertex of the bonded metal bump is performed using the same capillary tool. The dielectric and refractory tip of the capillary tool ends with a flat surface forming a sharp edge adjacent a concave mouth formed therein. A preformed metal ball held in the concave mouth is bonded to the metal pad of the integrated circuit. The method further includes the step of retracting the capillary tool from the bonded metal bump while allowing free movement of the capillary tool relative to the metal wire passing through an axial conduit of the capillary tool. Relative movement of the metal wire is blocked by clamping the metal wire as soon as the capillary tool is pulled off the bonded metal bump. The capillary tool is then laterally shifted for breaking off the metal wire. The vertex of the bonded metal bump and a residual wire stump is stamped forming a substantially flat and leveled contact area by re-lowering the capillary tool previously misaligned from the bonded metal bump. The wire clamp is released and the capillary tool is lifted and moved to the next metal pad with a portion of the metal wire emerging from the concave mouth.

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Romano di Lombardia, Italy

Battista Vitali