Amazon Technologies, Inc.

Bassam Abdel-Dayem

Thomas A Volpe

Diwakar Urjan Anandakumar

A semiconductor package can include a capacitance die. The package can have multiple dice (e.g., logic die, memory die) mounted on a substrate. Each die can include a power domain. The dice can be distributed on the substrate such that an extra space is present on the substrate between at least some of the dice. For example, an extra space may be present between two dice, at a corner of the substrate, or other locations. The extra space can disrupt a coplanarity of the semiconductor package. The capacitance die can be located in the extra space so as to establish the coplanarity with the other dice. The capacitance die can include a capacitor array electrically coupled to multiple power domains of the plurality of dice.

Semiconductor package with capacitance die

A system includes a rack with multiple hardware acceleration devices and multiple modular controllers coupled together into a single system implementing one or more servers. Each modular hardware acceleration device includes multiple hardware accelerators, such as graphical processing units, field programmable gate arrays or other specialized processing circuits. In each modular hardware acceleration device, hardware accelerators are communicatively coupled to a multi-port connection device, such as a switch, and also communicatively coupled to at least two external ports. A modular controller of a particular server coordinates operation of hardware accelerators of multiple hardware acceleration devices included in the particular server to provide advanced processing capabilities. Hardware accelerators may be dynamically assigned to particular processing servers to adjust processing capabilities of those servers. A particular server may be assigned one or more standby controller to enhance availability of the server.

Highly available modular hardware acceleration device

A stiffener ring can include a body sized for attachment to a substrate in a semi-conductor package. The stiffener ring body can have a top surface and a bottom surface. A through-hole may penetrate the body so as to extend through the top surface and the bottom surface and so that the body is formed as ring around the through-hole. An anchor surface can form a portion of the bottom surface and be configured for engaging the substrate. An elevated surface can also form a portion of the bottom surface and be elevated above the anchor surface.

Semiconductor package with stiffener ring having elevated opening

A semiconductor package can include a unitary substrate defining a first region and a second region. A first interposer can be mounted on the unitary substrate in the first region, and a first die can be mounted on the first interposer. A second interposer can be mounted in the second region on the unitary substrate, and a second die can be mounted on the second interposer.

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Santa Clara, CA, United States of America

Bassam Abdel-Dayem