Oceanit Laboratories, Inc.

Other

Basil Henry Scott

Randy Wolfshagen

Robert E Swanson

Kevin T C Jim

Justin Eiler

Jeff Buck

An integrated focal plane provides two co-aligned, overlapping pixel arrays in two formats, one with large pixels and low pixel count, the other with small pixels and high pixel count. Typically, the large pixels are 10 to 100 times larger in area than the small pixels. The dual arrays are disposed in a single detector substrate flip-chip bonded to a single readout circuit. They are sensitive to two infrared colors, one shorter and one longer wavelength band. The dual array focal plane concurrently provides two distinct pixel instantaneous fields of view within the same overall field of view as well as simultaneous fast and slow frame rates. The dual frame rates allow for combined fast sensing with sensitive imaging. Differing spatial and temporal data enables enhanced image processing for improved clutter rejection and detection performance. Differing gains combined with the dual frame rates provide an extended dynamic range.

Dual pixel pitch imaging array with extended dynamic range

GEO satellites and other space objects are studied in daylight, twilight and at night using IR cameras in clusters of no more than three with programs for pointing the instruments at known locations of the GEO objects and satellites and receiving weak near IR signals. Detection instruments have minimal optical surfaces and simple optical paths directing IR through Kshort and combined Kshort and H near IR band filters in cryogenic assemblies. Large focal ratios and large apertures reduce the effect of sky brightness, lower noise and improve the target signal, increasing the noise to signal ratio. Sky background noise is reduced by co-adding hundreds of pixels, allowing for the faint IR signal integration of one second or more. Results are read after integration.

Daytime infrared imaging of satellites

A pixel interconnect circuit that can be added to a focal plane array to enable subpixel location capability (subpixel sensing) for an imaged point source, facilitating very high frame rate operation. The pixel interconnect is typically added as a circuit component within the readout integrated circuit. The interconnect function can be turned on or off flexibly. It allows very low pixel count arrays, such as 128&#xd7;128 pixels, to achieve the positional accuracy of multi-megapixel arrays. In turn, these small arrays can be clocked at very fast frame rates for enhanced threat and fast event detection. Existing systems can be upgraded by adding the pixel interconnect, which will greatly improve tracking and position accuracy without increasing data processing requirements. By modifying the focal plane while leaving other components unchanged, the pixel interconnect provides an economical upgrade for threat warning and tactical sensor systems.

Subpixel resolution by interpolation of crosstalk from adjacent pixels

An event detection and classification system uses a new type of optical sensing component, a Position Sensing Detector Focal Plane Array (PSD-FPA). The PSD-FPA provides for high-speed operation that allows for accurate sensing of fast artifacts that are unique to weapons fire and enables precise location of optical phenomenon. The system detects and classifies events, particularly weapons fire, and rejects false alarms. An optical lens sub-system focuses light onto a PSD-FPA, which senses the photons and generates electrical signals associated with individual elements of the PSD-FPA. These signals are processed to identify and classify weapons-related or other events. Background subtraction, variable gain, time-intensity and time-location correlation, digital filtering, Fourier analysis, and wavelet analysis are all used to successfully classify the events while rejecting false alarms.

Position sensing detector focal plane array (PSD-FPA) event detection and classification system

A single focal plane integrated circuit hybrid replaces multiple focal plane circuits and associated off-focal plane signal processing electronics. A dual function, dual color focal plane PSD sensor chip assembly includes a PSD array, a traditional pixelized camera array, a signal processing chip, and flip-chip interconnects and wirebond pads to support electronics on the signal processing chip. The camera array is made of a material sensitive to wavelengths longer than the PSD array material is sensitive to. The PSD array is disposed in the same substrate as the camera array. The PSD array tracks object locations and directs the camera array to window and zoom while capturing images. Inherent registration of PSD cells to the pixelized camera array makes responsivity map testing and spatial calibration unnecessary. Reduction in power dissipation is achieved by powering on the camera array only when the PSD detects a change in scene.

Dual color/dual function focal plane

A Sensor Chip Assembly (SCA) contains a focal plane array constructed as a semiconductor chip sandwich. One slice contains an array of PSDs made from IR sensitive semiconductor material, and the other slice contains Trans Impedance Amplifiers (TIAs)&#x2014;and associated on-chip signal processing elements from an electronic semiconductor material. The SCA resembles those made for pixelized imaging IR SCA focal planes, but the configuration and implementation of which is for a PSD focal plane array. The use of these techniques assures that the PSD focal plane array possesses the required attributes. Interconnect technology is widely available from most IR fabrication houses to connect the IR array with the TIA circuits.

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Kapaa, HI, United States of America

Basil Henry Scott