Honeywell International Inc.

Basavaraja Sangappa Devaramani

Raju Addepalle Raghurama

John Stokely

Reusable substrate bases for producing multilayer semiconductor devices are provided, as well as free-standing semiconductor devices and reusable substrate bases produced for the multilayer semiconductor devices. The reusable substrate bases comprise a Si-based substrate, a transition lattice overlayed thereon, and a sacrificial ZnO-based layer overlayed on the transition lattice. The transition lattice comprises alternating transition layers of aluminum nitride (AlN) and GaN or Al-doped GaN. The multilayer semiconductor devices comprise the aforesaid reusable substrate bases and a semiconductor stack which comprises a pair of p-n junction forming layers. Methods for producing the multilayer semiconductor devices, the reusable substrate base, as well as free standing semiconductor devices detached from the reusable substrate bases, are also provided.

Reusable substrate bases, semiconductor devices using such reusable substrate bases, and methods for making the reusable substrate bases

Semiconductor devices useful as light emitting diodes or power transistors are provided. The devices produced by depositing a Zn&#x2014;O-based layer comprising nanostructures on a Si-based substrate, with or without a metal catalyst layer deposited therebetween. Furthermore, a pair of adjacent p-n junction forming layers is deposited on the ZnO-based layer, where one of the pair is an n-type epitaxial layer, and the other is a p-type epitaxial layer. One or more epitaxial layers may, optionally, be deposited between the ZnO-based layer and the pair of adjacent p-n junction forming layers.

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Karnataka, India

Basavaraja Sangappa Devaramani