Lumileds LLC

Philips Lighting Holding B.v.

Koninklijke Philips Corporation N.V.

Biomerieux Sa

Elacin International B.v.

Bas Fleskens

Peter Henri Bancken

Theodoor Cornelis Treurniet

Ralph Hubert Peters

Reinier Imre Anton Den Boer

Lambertus Adrianus Marinus De Jong

Harald Willwohl

Thomas Beumer

Tom Beumer

Jan Adrianus Verhave

Sander Jeroen Van Wijngaarden

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

Lighting assembly and method for manufacturing a lighting assembly

A method for manufacturing a lighting assembly is disclosed, wherein a light emitting diode (LED) element () is arranged on a leadframe (). The LED element () is configured to emit light when supplied with electrical power by means of the leadframe (). At least a portion of the leadframe () is provided with an optically reflective and electrically insulating material () arranged to reflect light emitted from the LED element () and to electrically insulate at least a portion of the leadframe (). A lighting assembly comprising the LED element () and the leadframe () is also disclosed.

This invention relates to a thermal interface device () arranged to provide a thermal coupling interface between a heat-generating unit () and a heat-removing unit (), comprising a liner layer (), which has opposite first and second surfaces (), at least the first surface being a slide surface, and which is provided with multiple perforations (); and a thermal connection layer (), which is engaged with the liner layer at the second surface () thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.

Thermal interface pad material with perforated liner

The invention describes an adapter part () for a modular lighting assembly () comprising a number of light-emitting diodes () mounted on a separate base part (), which adapter part () comprises a number of first electrical connectors () arranged to connect the light-emitting diodes () to an external power supply; at least one electrical component () arranged in a body of the adapter part (); and a number of second electrical connectors () arranged to connect external circuitry to an electrical component () arranged in the body of the adapter part (). The invention further describes a modular lighting assembly () comprising a base part () upon which a number of light-emitting diodes () is mounted; and an adapter part () according to the invention. The invention also describes a method of assembling such a modular lighting arrangement (), comprising the steps of connecting a first adapter part () according to the invention to a separate base part (); choosing a number of electrical components () on the basis of an application requirement of the modular lighting arrangement (); and arranging an electrical component () in the adapter part () such that an electrical connection is formed between a contact surface of the electrical component () and a second electrical connector () of the adapter part ().

Modular lighting assembly adapter part

There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM () is arranged between a heat generating component () and a heat conducting element (), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.

Thermal interface material

Pipetting errors are detected by: (a) during pipetting, measuring the pressure in the tip of a pipetting device and determining an earlier rate of change of the pressure in the tip; (b) based on the earlier rate of pressure change and a previous pressure value p, determining an expectation range for the pressure pat a further moment in time and/or an expectation range for the rate of pressure change &#x3b4;based on the pressure at the further moment in time t; (c) at the further moment in time tmeasuring the pressure pin the tip; and (d) determining the occurrence of a pipetting error by comparing the measured pressure pat the further moment tin time and/or a rate of pressure change &#x3b4;calculated on the basis of the pressure pat the further moment tin time.

Growing community of inventors

Eindhoven, Netherlands

Bas Fleskens