Iptrade, Inc.

Cymer, Inc.

Baruch Pletner

Gregory A Zvonar

Leonard Lublin

Grace R Kessenich

Wesley T Horth

Robert N Jacques

David J Warkentin

John A Rule

Ronald L Spangler

Emanuele Bianchini

Richard Perkins

Betsy Marsh

Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Kit and method for constructing vibration suppression and/or sensing units

A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.

Unimorph/bimorph piezoelectric package

A scalable piezoelectric package comprising a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cells together, such that the external connector of each of the piezoelectric cells is electrically coupled to the piezoelectric plate of each of the remaining piezoelectric plates of the piezoelectric cells.

Scalable piezoelectric package

A method of implementing vibration suppression at equipment residing at a local site includes the steps of transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further includes the steps of analyzing the sensed vibration response information at the remote site and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transferred from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed. The additional vibration response information is transmitted to and analyzed at the remote site where a modified suppression algorithm is created and transmitted to the local site for suppression of vibrations in the equipment.

Method for implementing vibration suppression system under control from a remote site

A vibration control system comprising an actuator, and a sensor useful for controlling vibrations in systems for fabricating electronics equipment. The actuator may comprise one or more plates or elements of electro-active material bonded to an electroded sheet.

System for vibration control

A multi-input, multi-output vibration control system for a lithography system. The system provides an actuator, and a sensor useful for controlling vibrations in systems for fabricating electronics equipment. The system includes a processor programmed with a multi-input, multi-output control technique such as a linear quadratic Gaussian, H-infinity or mu synthesis. The actuator may comprise one or more plates or elements of electroactive material bonded to an electroded sheet.

Multi-input, multi-output motion control for lithography system

A system that provides a base stabilization system for controlling motion of a controlled structure. The system includes a ground structure such as the floor of a fabrication facility and the controlled structure includes a base on which equipment is mounted. The system also includes at least three air mounts and a plurality of actuators all attached to the ground structure and to the base to isolate the base from the ground structure and to stabilize the base. The system includes a plurality of position and acceleration sensors each of which are co-located with a corresponding actuator. The system also includes a multi-input, multi output feedback control system comprising a computer processor programmed with a feedback control algorithm for controlling each of the actuators based on feedback signals from each of the sensors. The co-location of the sensors with the actuators avoids serious problems resulting from higher order vibration modes.

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Newton, MA, United States of America

Baruch Pletner