Asm International N.v.

Asm IP Holding B.v.

Bartholomeus Hans Louis Lindeboom

Lucian C Jdira

Chris G M De Ridder

Gert-Jan Snijders

Juul Keijser

An apparatus (), including a gas recirculation circuit comprising a mini environment chamber (), a gas pump (), a filter assembly () which are connected by a recirculation channel (). The apparatus additionally includes an air supply conduit () for supplying air to the gas recirculation circuit and having an air supply conduit inlet () which opens into the ambient air and an air supply conduit outlet () which opens in the recirculation circuit. In use, a mini environment chamber pressure (P) is maintained higher than the ambient pressure (P). The gas recirculation channel () includes a substantially frictionless recirculation restriction embodied as a throat (). At downstream end of the throat which forms the narrow part of the throat, in use, the static pressure is below the ambient pressure. The air supply conduit outlet opens at the downstream end () of the throat.

Apparatus including a clean mini environment

A wafer boat cooldown device comprising a bottom plate and a rotatable table that is rotatable between a number of index positions. The rotatable table comprises at least two wafer boat positions for supporting a wafer boat. A vertically extending wall structure is mounted on the rotatable table and creates, at each wafer boat position, a wafer boat chamber having a gas supply area and a gas discharge area. The wafer boat cooldown device further comprises a plenum chamber which extends under the bottom plate. The plenum chamber accommodates at least one gas/liquid heat exchanger.

Wafer boat cooldown device

Particle formation in semiconductor fabrication process chambers is reduced by preventing condensation on the door plates that seal off the process chambers. Particles can be formed in a process chamber when reactant gases condense on the relatively cool surfaces of a door plate. This particle formation is minimized by heating the door plate to a temperature high enough to prevent condensation before flowing reactant gases into the process chamber. The door plate can be heated using a heat source, e.g., a resistive heater, that is in direct contact with the door plate or the heat source can heat the door plate from a distance by radiative or inductive heating. In addition, the door plate can open to allow loading and unloading of a wafer load. As it passes flanges near the door plate, the wafer load can transfer heat to those flanges. To prevent overheating, the flange is provided with a coolant-containing channel having walls that are spaced from the flange by O-rings. The spacing of the channel walls to the flange can be varied to vary the amount of thermal contact and cooling achieved using the channels.

Growing community of inventors

Blaricum, Netherlands

Bartholomeus Hans Louis Lindeboom