Qualcomm Incorporated

Bart Kassteen

Alberto Jose Teixeira De Queiros

Markus Valtere

Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.

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Helden, Netherlands

Bart Kassteen