Motorola Corporation

Amkor Technology, Inc.

Barry M Miles

Frank J Juskey, Jr

Bruce J Freyman

Jill L Flaugher

Glenn E Gold

Robert Francis Darveaux

Curtis Michael Zwenger

Sivakumar Muthuswamy

Thomas J Swirbel

Anthony B Suppelsa

Jeffrey Alan Miks

William B Mullen, Iii

Dale W Dorinski

Kingshuk Banerji

Robert Benjamin Akins

Lee John Smith

David E Reiff

Joseph Guy Gillette

Lonnie L Bernardoni

Marc V Papageorge

Leonard F Altman

Alexander William Copia

Keith D Soldner

A memory card comprising a flexible substrate (a 'flex') which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.

High density memory card using folded flex

An integrated circuit package (,) comprises a semiconductor die (,), and a substrate (,) for receiving the semiconductor die. The substrate has an aperture(s) (,) below the semiconductor die for providing moisture relief during temperature excursions. The semiconductor die is wirebonded to the substrate. An encapsulant (,) seals the top surface of the semiconductor die and serves to bond the semiconductor die to the substrate. The encapsulant also covers portions of the top side of the substrate.

Moisture enhanced ball grid array package

The invention discloses a method of making solder ball mounting pads on a substrate that have better ball shear performance, ball thermal cycle reliability, ball attach yield, and ball positional tolerances, than the solder ball mounting pads of the prior art. The method includes providing a sheet of material having a layer of metal thereon, and patterning the layer to define a solder ball mounting pad therein. The pad includes a central pad having at least two spokes radiating outward from it. An insulative mask is formed over the metal layer, and an opening is formed in the mask such that the central pad and an inner portion of each of the spokes is exposed therethrough, and an outer portion of each of the spokes is covered by the mask. In one embodiment, the central pad, spokes, and opening in the mask are shaped and arranged with respect to each other such that the pad and exposed portion of the spokes form a radially symmetrical pattern within the opening.

Making solder ball mounting pads on substrates

An improved leadless semiconductor device package consists of a molded plastic carrier (30) with a plurality of C5 bumps (52) integrally molded into the bottom side of the carrier. The bumps are made of the same plastic as the carrier and are monolithic to the carrier. The C5 bumps are coated with a solderable material (50) so that they can be connected to pads on a PCB with solder paste. The top side of the plastic carrier has a metallization pattern containing a plurality of bond pads (44) that correspond to pads on the semiconductor die, and the bond pads are electrically connected to the C5 bumps by an electrically conductive structure. A semiconductor die (38) is mounted on the carrier top side and electrically connected to the plurality of bond pads, either by wire bonds (54) or by flip chip bonding. C4 bumps (70) can also be molded into the carrier for flip chip attachment.

Molded plastic ball grid array package

An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.

Moisture relief for chip carriers

An integrated circuit package (10) comprises a semiconductor die (12), and a substrate (14) having a through-cavity opening (22) for receiving the semiconductor die. The bottom side of the substrate has solder pads (24) arranged as a peripheral pad grid array. The semiconductor die is wire bonded (26) to the to the top side of the substrate. An encapsulant (16) seals the top surface of the semiconductor die and circuitry, and portions of the top side of the substrate. The bottom surface of the semiconductor die remains exposed to the atmosphere, eliminating moisture-related die attach delamination issues and improving heat transfer away from the semiconductor die. Furthermore, the reduced contribution of the semiconductor die to overall package height results in an ultra low profile package.

Low profile exposed die chip carrier package

A semiconductor device package comprises an integrated circuit chip (10), a substrate (16), an encapsulant (30), and an organic coupling agent or underfill material (12) disposed between the integrated circuit chip and the first side of the substrate. The chip has a plurality of interconnection pads (14) disposed on an active surface of the chip at some minimum spacing 'X.' Each of the interconnect pads also has electrically conducting bumps (26) on them. The substrate has a circuit pattern (20) on a first side and an array of solder pads (23) spaced a certain distance apart on an opposite side of the substrate. The distance between these pads is greater than the minimum distance (X) between the interconnect pads on the IC. The circuit pattern is electrically connected to the array of solder pads by plated through holes (22). The length and width of the circuit carrying substrate is substantially greater than the length and width of the integrated circuit chip. The chip is mounted face down to the substrate with the electrically connecting bumps, such that at least some of the plated through holes in the substrate are covered by the chip. The polymeric encapsulant (30) covers the entire chip and substantially all of the first side of the substrate, providing a sealed package.

Leadless integrated circuit package

A liquid crystal device (5) is made by providing an LCD sandwich made of two glass substrates (20) with electrodes, spacers (21), and an uncured sealant (22). A gap (26) with a specified internal volume lies between the two glass substrates. A vacuum reservoir (23) having an internal volume substantially larger than the internal volume of the gap is temporarily attached to the LCD sandwich to align the glass substrates and hold them in place. The LCD sandwich and vacuum reservoir are placed into a conformable container or vacuum bag (24). A vacuum is drawn on the bag so that the bag walls contact the LCD sandwich, and the bag is sealed to maintain the vacuum. The assembly is then heated while under vacuum for a time and a temperature sufficient to cause the gap in the LCD sandwich to decrease to a desired final gap and to cure the sealant.

Method of manufacturing a liquid crystal display device in which a

Moisture relief for chip carrier

A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator solution to substantially remove the tin from the substrate. The palladium which remains on the substrate surface provides nucleation sites for adhesion promotion and enhanced wetting of polyimide which is applied in a liquid form as by spraying or spinning. Adhesion of polyimide to metals such as gold, ceramics, alumina or polyimide is thereby provided.

Method for adhering polyimide to a substrate

A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.

Transfer molded semiconductor device package with integral shield

A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an array of solderable surfaces (24). A polymer coating (18) is applied over the semiconductor device (12), the wirebonds (16), and the top side of the printed circuit board (10) and cured. The coating (18) is then sputter etched in a partial vacuum to enhance the adhesion of the transfer molding compound (20) to the printed circuit board (10). The semiconductor device is encapsulated by a transfer molding process. The polymer coating (18) also provides a barrier to alpha particle emission, improves the moisture resistance of the completed package and reduces stress at the surface of the device.

Transfer molded semiconductor package with improved adhesion

A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).

Flexible film chip carrier having a flexible film substrate and means

A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).

Grounding an ultra high density pad array chip carrier

A flexible substrate (100) carries circuitry (102) in one area of the substrate and other portions of the substrate are at least partially covered with conductive material (206) to provide a ground plane. The substrate is folded about the circuitry to form an enclosure shielding the circuit.

Growing community of inventors

Plantation, FL, United States of America

Barry M Miles