Sarnoff Corporation

Lamina Ceramics, Inc.

David Sarnoff Research Center, Inc.

General Electric Company

Rca Inc.

Other

Thomson Licensing S.a.

Lamina Ceramics, in

Barry Jay Thaler

Ashok Narayan Prabhu

Ananda H Kumar

Ellen Schwartz Tormey

Bernard Dov Geller

Mark Stuart Hammond

Edward J Conlon

Robert L Quinn

Michael James Liberatore

Aly Eid Fathy

Thomas Peter Azzaro

Hung-tse Daniel Chen

Joseph B Mazzochette

Peter John Zanzucchi

John Charles Connolly

Attiganal Narayanaswamy Sreeram

Ramon Ubaldo Martinelli

Robert Richard Demers

Leszek Hozer

Gerard Frederickson

Ponnuswamy Palanisamy

Paul Leonard Braun

Attiganal Narayanswamy Sreeram

Ponnusamy Palanisamy

Satyam Choudary Cherukuri

George Herbert Needham Riddle

Sterling Eduard McBride

Aaron W Levine

James Regis Matey

Roger Casanova Alig

Steven A Lipp

Philip Michael Heyman

Sterling Edward McBride

Liyou Yang

Harry Louis Pinch

William Chiang

Lubomyr S Onyshkevych

Charlotte A Burton

Edward Mykietyn

Zhonghui Hugh Fan

Conghua Wang

Joseph H McCusker

James R Young

Attiganal Narayanaswamysreeram

Stayam C Cherukuri

Attinganal Narayanaswamy Sreeram

Richard Joseph Quinn

Wei H Tsien

A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.

Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards

Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

High performance embedded RF filters

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate

Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Low temperature co-fired ceramic-metal packaging technology

A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.

Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate

An electron gun as for a cathode ray tube includes a plurality of electrodes biased at different potentials to electrostatically shape and focus the one or more electron beams produced thereby. A dynamic focus grid is driven by a substantial ac voltage signal at the horizontal line rate, which signal is undesirably coupled through parasitic capacitance to an intermediate grid located between the dynamic focus grid and the gun anode. A resistive biasing network includes a high value resistance to divide the anode potential to develop bias potential for the intermediate grid and a capacitance to ac couple the intermediate grid to ground potential. The resistance is formed in a single layer ceramic circuit and the capacitance is formed on the single layer ceramic circuit or on the tube neck. The ceramic circuit may be located in the tube neck on or with the electron gun.

Electron gun with resistor and capacitor

Solid oxide fuel cells made by coating a slurry of an electrolyte having a limited amount of organic material onto a carrier tape, depositing a one or two layer electrode material on the tape sufficient to support the electrolyte layer, removing the tape, screen printing a second electrode layer on the exposed surface of the electrolyte layer, and firing the layers at a temperature of 1100-1300&deg; C. The resultant fired fuel cell can be mounted on an interconnector comprising a base plate, grooves formed in one face of the base plate, a porous conductive ceramic contact layer between the base plate and an overlying blocking layer of a porous conductive layer to provide electrical contact between the base plate and the blocking layer, or an interconnector having a fired green tape stack having conductive via contacts and air and gas flow channels formed therein. A sealing glass bonds the overlying layers to the base plate. Such interconnector-mounted fuel cells can be stacked together to increase the voltage output of the fuel cells which can be used to power a load.

Solid oxide fuel cells and interconnectors

A color cathode-ray tube (CRT) has an evacuated envelope with an electron gun therein for generating an electron beam. The envelope further includes a faceplate panel having a luminescent screen with phosphor elements on an interior surface thereof. A focus mask, having a plurality of spaced-apart first conductive strands, is located adjacent to an effective picture area of the screen. The spacing between the first conductive strands defines a plurality of apertures substantially parallel to the phosphor elements on the screen. Each of the first conductive strands has a substantially continuous slightly conductive insulating material layer formed on a screen facing side thereof. A plurality of second conductive wires are oriented substantially perpendicular to the plurality of first conductive strands and are bonded thereto by the slightly conductive insulating material layer. The slightly conductive insulating material layer is a composite material comprising one or more transition metal oxides and a lead-zinc-borosilicate glass.

Slightly conducting insulators for cathode-ray tube (CRT) applications

Ceramic multilayer circuit boards mounted on a patterned metal support substrate

A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.

Method of forming metal contact pads on a metal support substrate

Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology

Various mixtures of lead magnesium niobate and lead titanate are made, each mixture having a different Curie temperature, wherein these mixtures are mixed together to form capacitor inks that can be used to make capacitors embedded in multilayer ceramic circuit boards. These capacitors have extended temperature ranges of operation as well as low loss tangents and high dielectric constants.

High dielectric constant buried capacitors with extended operating temperature ranges

High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Low dielectric loss glasses

Low dielectric loss glass ceramic compositions

Growing community of inventors

Lawrenceville, NJ, United States of America

Barry Jay Thaler