International Business Machines Corporation

University of Illinois

Barry Jay Rubin

Alina Deutsch

Jason David Morsey

Howard Harold Smith

Gerard Vincent Kopcsay

Byron Lee Krauter

Peter Feldmann

Fung Yuel Chang

Moises Cases

David J Widiger

Narasipur G Anantha

Michael Alexander Bowen

Weng C Chew

Yuan Liu

Lijun Jiang

Ibrahim M Elfadel

Matthew S Angyal

Winfried W Wilcke

George A Katopis

Albert E Ruehli

Robert Barton Garner

Evan Ezra Davidson

Minakshisundaran Balasubramanian Anand

Erik Breiland

Mao-Kin Li

Howard Kahn

Anita A Mayo

Mao-kun Li

A method for performing a signal integrity analysis on an integrated circuit (IC) that includes a plurality of scatterers by dividing the scatterers into subgroups using a nested Huygens' equivalence principle algorithm and solving a set of equations realized thereby with a reduced coupling matrix. The method includes decomposing the IC design into a plurality of small non-overlapping circuit sub-domains, wherein each of the sub-domains is formed as a small, enclosed region. Each sub-domain is analyzed independently of the other sub-domains using only electric fields to represent the interactions of each sub-domains with the other sub-domains as equivalent currents on equivalent surfaces of the plurality of sub-domains. Neighboring equivalent sub-domains are grouped together to form larger sub-domains using equivalent currents on equivalent surfaces to represent the interactions of the sub-domains. The steps of analyzing and grouping the sub-domains are repeated until the grouping approaches a box comprising the entire domain, and that the domain interactions between every sub-domain have been analyzed.

Huygens' box methodology for signal integrity analysis

This invention relates to computing numerical solutions of linear systems of equations, specifically to implementing preconditioning of the coefficient matrix of such a system. The preconditioning applies to any coefficient matrix, dense or sparse, based on the solutions of a physical problem of unknown functions, commonly referred to as basis or interpolation functions, where the basis function spans more then one mesh element. Examples of such linear systems can result from, as examples, an electromagnetic analysis of printed circuit boards or field scattering in radar applications, fluid mechanics and acoustics. A method and system to compute a preconditioner for a coefficient matrix A that is compatible with the linear system of equations that provides basis function support over at least two mesh elements. Coupling of the preconditioner between partitions of a portioned mesh representation is only through basis functions at the partition boundaries.

Method, apparatus and computer program providing broadband preconditioning based on a reduced coupling for numerical solvers

Method, apparatus and computer program providing broadband preconditioning based on reduced coupling for numerical solvers

A method and system is provided for analyzing a package having components. The package may include electrical or computer components. The method and system uses a computer program to receive inputted data and extract data from files. The computer program also selects the best sub-program to analyze the data to compute the parameters for packaging the components and designing the package, and displays the results of the analysis.

Electrical package analysis gateway

An integrated circuit chip has new Frequency dependent RLC extraction and modeling providing on chip integrity and noise verification and the extraction and modeling employs:

Integrated circuit chip having on-chip signal integrity and noise verification using frequency dependent RLC extraction and modeling techniques

New Frequency dependent RLC extraction and modeling for on chip integrity and noise verification employs:

Method for on-chip signal integrity and noise verification using frequency dependent RLC extraction and modeling techniques

A computer aided design (CAD) system. A template generation engine generates templates from interconnect configuration files. A field solver generates high frequency passive element relationships from the templates. A circuit builder generates circuit description files from device technology models and from high frequency passive element relationships. Parameterized circuit description models may be generated for large range of sensitivity analyses. A simulator simulates circuit responses for transmission line models from the circuit description files. Interconnect configuration files may be generated by a geometry and material definition module that receives process description data from a designer.

Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures

A scalable and compact computer system of three-dimensional subsystems each having capacitive couplers on its external surfaces for transmitting and receiving electrical signals to and from adjacent subsystems. Each surface having an electrically non-conducting substrate, one or more electrically conducting pads on the substrate, and electrical leads for coupling the pads to the subsystem's circuits. Two adjacent pads, each from a different subsystem, form a capacitive coupler to carry the signals between the subsystems. The pads are covered by a low-loss dielectric material having a large dielectric constant for improved signal transmission. A differential signal may be supported using two capacitive couplers to respectively carry the positive and negative signals of the differential signal. The subsystems might be replaced or left in place when they failed. Additional subsystems might be added to the system to expand its capacity.

Scalable computer system having surface-mounted capacitive couplers for intercommunication

The present invention relates to a method for analyzing the noise prediction within one or more electrical circuits, wherein the electrical circuits have a power mesh grid distribution system that feeds power levels to the electrical circuits that are connected by signal wires. After identifying a driver and receiver electrical circuit to be analyzed, a power block is generated that is associated with the driver and receiver electrical circuit by partitioning an area of a power mesh grid distribution system into a power block that can be modeled with lossy transmission line techniques. Next, signal wires situated between the driver and receiver electrical circuits are partitioned into signal blocks that can be modeled with lossy transmission line techniques. Lastly, the power blocks and signal blocks associated with the electrical circuits are analyzed in order to predict the noise performance within the electrical circuits.

Method to include delta-I noise on chip using lossy transmission line representation for the power mesh

The method of the present invention determines the voltage, current, and/or power distribution in a power supply or other resistive network containing holes or contacts having non-rectangular boundaries. The method includes applying a grid over the resistive network. Because the holes and contacts have non-rectangular boundaries, the grid lines are not always coincident with these boundaries. A set of modified finite difference equations are then solved to derive a voltage distribution. Unlike conventional methods, these equations have been specifically adapted to the non-rectangular boundaries of the holes and contacts.

Method for determining voltage, current, and/or power distributions in a resistive structure using a rectangular grid algorithm modified for non-rectangular holes and contacts

A technique for simplifying a structure so that subsequent electrical analysis can be more efficiently performed. The technique includes facility to modify the existing shapes in the structure so that they do not overlap, to determine the allowed movement of each edge of each shape in the structure, to apply a set of factors to each movement that determines how advantageous the movement is with respect to the number of unknowns and the change in geometry and/or electrical parameters of the structure, and to choose and then make the movement associated with the highest factor. The factors are unity based so that the desirability of the move is given by the product of all the factors. The technique includes facility to iterate, calculating the factors and making the movement associated with the greatest factor, until the factor falls below a given threshold. The resulting structure will be similar in electrical characteristics to the original structure, yet require fewer unknowns to analyze.

Intelligent structure simplification to facilitate package analysis of complex packages

A methodology and circuit modeling structure for analyzing the packaging of electrical circuits and determining electrical circuit properties, e.g., inductance, capacitance, of circuits and circuit structures found in VLSI chips, PC cards, boards, microwave circuits, etc. The methodology and circuit modeling structure includes modifying the original signal line structure in the circuit to be analyzed by including a shadow line structure in the analyzed circuit and locating the shadow line structure between a ground plane structure and an associated signal line structure at an infinitesimal distance above the ground plane. Additionally, for each shadow line structure, there is provided a first via structure for connecting a first end of said shadow line to the ground plane and, a second via structure connecting a second end of the shadow line to the ground plane. The modified shadow line structure is readily implemented in 3D circuit package analysis programs and provides a computationally efficient way to analyze complex types electrical/electronic/packaging circuits and structures.

Structure for improved capacitance and inductance calculation

A method comprising a computational procedure for obtaining capacitances for three-dimensional geometries which include multiple regions with different dielectric constants. The methodology is not limited to uniform dielectrics. The dielectric regions can also consist of non-uniform and/or anisotropic materials.

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Croton-on-Hudson, NY, United States of America

Barry Jay Rubin