Lsi Logic Corporation

Symbios Logic Inc.

Barry E Caldwell

Craig C McCombs

Raymond S Rowhuff

Kenneth J Thompson

Christopher B Ross

Larry Leon Stephens

A fluted signal pin provides expanded surface area for high frequency operation which minimizes inductive and capacitive effects. The signal pin may be mounted to a circuit board via a support stanchion or membrane during assembly or repair. The membrane may be permanent or removable by heat, water, and/ or detergent. A pin cap optionally is provided to ensure attachment to an overlying integrated circuit package.

Fluted signal pin, cap, membrane, and stanchion for a ball grid array

The present invention is directed to a composition with electromagnetic compatibility (EMC) characteristics. In an aspect of the present invention, an adhesive suitable to provide a bond between components may include an adhering material suitable for holding a first surface and a second surface in contact. A plurality of items is disposed in the adhering material. The plurality of items has electromagnetic capability shielding characteristics.

Composition with EMC shielding characteristics

The present invention is directed to a parallel/serial SCSI with legacy support. A small computer system interface (SCSI) converter module may include a small computer system interface (SCSI) converter. The converter is suitable for converting a parallel bus structure to a serial bus structure, and the converter is also suitable for supporting a parallel bus structure to a parallel bus structure.

Parallel/serial SCSI with legacy support

A power ground short circuit with adjustable activation delay and activation time period eliminates latent voltages in the power down/ off discharging circuitry. The circuit uses an internal back up power storage device to supply power on power down. A comparator determines when the power down condition occurs. Two timers are used to generate an activation signal for a charge pump. The charge pump is responsible for turning on a pair of transistors which bring the power bus voltage down to a zero level. A slew rate detector enables the comparator.

Power ground short circuit, with adjustable activation delay and activation time period

The present invention is directed to the present invention is directed to an adhesive pad with electromagnetic compatibility (EMC) characteristics. An adhesive pad suitable for bonding electrical components may include a thermal bonding adhesive material and a lattice interlayer. The adhesive material is suitable for being disposed between the first electrical component and the second component, the thermal bonding adhesive bonding the first electrical component to the second component. The lattice interlayer is included within said thermal bonding adhesive material, the lattice interlayer having electromagnetic capability (EMC) shielding characteristics.

Adhesive pad having EMC shielding characteristics

The present invention is directed to a heat dissipation structure for an integrated circuit package, comprising a thermally conductive solid layers, one of which has receptacles for holding a thermally conductive flowable material, the heat dissipation structure being placed between the electronic component and the printed circuit board. The present invention is used advantageously with a primary heat sink placed on the top side of the integrated circuit package away from the printed circuit board. The heat dissipation structure preferably hemispherical balls on the package side of a high heat conductive plate to improve heat transfer from the die to the integrated circuit, especially, BGA, substrate to PCB power planes for heat dissipation and leads to improved secondary heat transfer from IC die in BGA packages to the heat spreader power planes in the system PCB. The heat dissipation device allows retro-fit of the heat transfer/transfer mechanism or primary attachment.

BGA heat ball plate spreader, BGA to PCB plate interface

A concentric optical cable and connector capable of full duplex transmission of optically encoded information is disclosed. The concentric optical cable comprises at least a core optical conductor suitable for conducting a light beam encoded with a first set of optically encoded information concentrically disposed about a concentric optical conductor suitable for conducting a light beam encoded with a second set of optically encoded information. The connector includes a first connector portion suitable for connection of the core optical conductor of the optical cable. The first connector portion is substantially concentrically disposed about a second connector portion suitable for connection of the concentric optical conductor of the optical cable thereby providing full duplex transmission of information. In this manner, the optical cable and connectors are capable of full duplex transmission of the first and second sets of optically encoded information.

Concentric optical cable with full duplex connectors

The present invention is directed to an apparatus suitable for mounting an integrated circuit (IC) including a frame suitable for receiving an integrated circuit (IC). The frame includes at least one leg coupled to the frame, the leg suitable for engaging a circuit board so as to enable the apparatus to be secured to the circuit board, thereby securing the integrated circuit (IC). At least one of the frame and leg include a conductive material so as to create at least one of a heat conducting path and an EMC ground path between the integrated circuit (IC) and the circuit board.

Apparatus suitable for mounting an integrated circuit

The present invention is directed to an electrical connector including a first connector pin suitable for making contact on a side of a first flat conductor surrounded by an insulator and a second connector pin suitable for making contact on a side of a second flat conductor surrounded by an insulator. The first flat conductor and the second flat conductor are spaced to form an electrical differential pair.

Electrical connector and cable

A method and apparatus dissipates heat generated by an electronic device. The apparatus includes a channel structure that is in thermal communication with heat generated by the electronic device. The apparatus further includes a pump array operative to advance fluid within the channel structure. In addition, the apparatus includes a baffle array positionable in relation to the channel structure in a first group position and a second group position, wherein fluid advancing within the channel structure is diverted to flow (i) in a first flow path defined in the channel structure when the baffle array is positioned in the first group position, and (ii) in a second flow path defined in the channel structure when the baffle array is positioned in the second group position.

Heat dissipating apparatus and method for electronic components

An apparatus for mounting a heat sink to a chip package such as a BGA type chip package or the like is disclosed. In an exemplary embodiment, ground bumps are formed on the die substrate of the chip package and on the heat mating surface of the heat sink to be attached to the package. The ground bumps formed on the die protrude into the body of dimples formed in the body of the chip encapsulation package to make thermal/electrical ground contact with the ground bumps formed on the heat mating surface of the heat sink for electrically grounding the heat sink.

Heat sink with chip die EMC ground interconnect

A connector and pin structure for coupling with a higher density, finer conductor pitch ribbon cable or the like is disclosed. The connector has an array of pins disposed thereon where a beveled tip of the pin allows for the pin to penetrate the insulation sheath of a corresponding conductor, and the pins have a contacting structure that facilitates contact between the pin and the conductor. In one embodiment, such as where the conductor comprises a braided conductor, each pin has a bulge structure that allows for optimal contact between the pin and the conductor. In another embodiment, such as where the conductor comprises a braided conductor or a solid wire conductor, the pin is asymmetrical and has a notch structure that allows for optimal contact between the pin and the conductor. In an embodiment where the ribbon cable has two layers, a first subset of the array of pins contacts the first layer, and a second subset of the array of pins contacts the second layer with the position of the contact structure corresponds to the position of the respective layer of the cable. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other researcher to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72( ).

Piercing pin structure and attachment for higher density ribbon cable

An electrical cable suitable for transmission of data signals cable includes a dual layer ribbon cable with a first layer being offset from the other layer by an offset distance. The dual layer ribbon construction of the cable allows the cable to be compliant with a SCSI standard and to include a VHDCI compliant connector. The cable may have a first Z form where a spacer connects an insulator in the first layer with an insulator in the second layer, a second form in which an insulator of the first layer is attached to an insulator in the second layer, or a modified second form in which a spacer is attached between adjacent insulators in the same layer. The double layer ribbon cable construction allows the width of the cable to be reduced to accommodate a smaller pitched, larger pin number VHDCI compliant connector anywhere along the length of the cable. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other researcher to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

Electrical cable

The present invention is directed to an electrical cable. An electrical cable may include a first flat conductor surrounded by an insulator and a second flat conductor surrounded by an insulator, wherein the first flat conductor and the second flat conductor are spaced so as to form an electrical differential pair.

A battery charging circuit for portable electronic devices including a photovoltaic cell for generating electrical current for charging of batteries. The charging circuit includes a state machine charge control circuit to selectively apply the electrical current generated by the photovoltaic cell to the batteries for charging and/or to the operational circuits of the portable electronic device for operation of the device. The photovoltaic cell, charge control circuit and operational circuits may be packaged in a number of alternative embodiments. In a first embodiment the photovoltaic cell and charge control circuit are integrated in a single circuit package. In a second, the various components are in separate circuit packages to enhance flexibility in design options. In a third embodiment, the charge control circuit is integrated with the operational circuits of the device. The charging circuit may be physically affixed to the portable device or may be electrically coupled to the device through a holder used to carry the device when not in use.

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Whitewater, KS, United States of America

Barry E Caldwell