Motorola Corporation

Other

Barry Boaz Groman

Scott G Potter

Anthony B Suppelsa

Daniel Joseph Viza

Everett Alan Clayton

Christopher M Kerlin

The present invention is a superior micro abrasive blasting device ( ) with an integral flow control mechanism. Flow control is achieved through the displacement of discharge conduit ( ) to control the distance between discharge conduit inlet ( ) and mixing chamber second end wall ( ). The flow control mechanism provides for the continuous pressurization of the mixing chamber ( ) to yield instantaneous flow start-up response and instantaneous flow shut-off response. A method is provided for maintaining discharge conduit outlet ( ) stationary with respect to target material ( ) while discharge conduit inlet ( ) is displaced. The method utilizes the deflection properties of discharge conduit ( ) to provide the necessary compliance so the discharge conduit inlet ( ) can be displaced while the discharge conduit outlet ( ) remains stationary. The deflection properties of the discharge conduit ( ) are also utilized to provide a sealing force between discharge conduit inlet ( ) and mixing chamber second end wall ( ). The sealing force assures that discharge conduit inlet ( ) abuts mixing chamber second end wall ( ) when the device is not operational. The deflection properties of discharge conduit ( ) are also utilized to apply a displacement restoring force on discharge conduit ( ) to close the distance between discharge conduit inlet ( ) and mixing chamber second end wall ( ) when the device is operational.

Micro abrasive blasting device and method with integral flow control

The present invention is a superior micro abrasive blasting device ( ) with an integral sealed reservoir ( ) that converts into a mixing chamber ( ). When not in use, the micro abrasive blasting device ( ) forms a sealed reservoir ( ) that protects the stored particulate matter ( ) from contamination and spillage. When the device is setup for use, the sealed reservoir ( ) transforms into an operational mixing chamber ( ). A method is provided for easily unsealing reservoir ( ) and turning it into the mixing chamber ( ) in a single motion. In the preferred embodiment, a compliant closure cap ( ) is displaced along the container side wall ( ) in the direction of the container end wall ( ) . The displacement causes the gas-delivery conduit ( ) disposed within the reservoir ( ) to protrude through the compliant closure cap ( ) and to form a gas-receiving port ( ). The same displacement to the closure cap ( ) removes the discharge conduit cap ( ) internal to the sealed reservoir ( ), opening the discharge conduit inlet ( ) for particulate matter ( ) passage. The position of closure cap ( ) with respect to the discharge conduit inlet ( ) provides means for gas-abrasive flow regulation.

Micro abrasive blasting device and method

An applicator (300) provides a tool for depositing processing media (510), such as a tacky flux agent, on predetermined surface areas (715) of a circuit substrate (705). The applicator (300) has a portion formed from a flexible compressible material with a surface (302, 325) patterned to have projections (325) that correspond in location to the predetermined surface areas (715) of the circuit substrate (705). The applicator (300) is preferably formed by polymerizing resin material using an image that corresponds to the circuit substrate (410, 420, 430).

Method of forming an applicator for applying tacking media to a circuit

A method for depositing a tacking agent (18) onto a circuit-carrying substrate (e.g., a printed circuit board) (22) such that a regulated volume is simultaneously deposited at multiple substrate sites (24). A first input pressure, P1, introduced through a bladder inlet (12), is supplied to a compliant bladder (14) which is in contact with a plurality of transfer pins (16). The compliant bladder imparts a substantially equal force to each of the transfer pins. The pins are then dipped into a thin film of tacking agent and removed. Subsequently, the first input pressure, P1, is adjusted to a second input pressure, P2, sufficient to force the pins to a uniform maximum extension. Finally, the second input pressure, P2, is adjusted to a third input pressure, P3, which imparts a predetermined uniform force on each of the pins, and the pins are brought in contact with the printed circuit substrate deposition sites. Thus, a uniform, predetermined volume of tacking agent is transferred to each of the board deposition sites, by regulating the force applied to the plurality of pins.

Method to achieve regulated force contact in pin transfer deposition of

A method of mounting an integrated circuit carrier (10) having a plurality of straight leads (12) retained by an integral frame (16) is provided. The plurality of straight leads (12) of the carrier (10) is bent to form a plurality of bent leads (12) still retained by the frame (16). The plurality of bent leads are then scored to form a notch (32) on each bent lead. Solder fluxing, placing, and reflowing the plurality of bent leads of the integrated circuit carrier against corresponding printed lines of the printed circuit (26) surface before each notch follow. Finally, a remainder portion of the plurality of leads from and including the frame (16) to the notch (32) on each lead (12) is removed.

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Margate, FL, United States of America

Barry Boaz Groman