Intel Corporation

Barrett M Faneuf

Stephen W Montgomery

David S De Lorenzo

William E Berry

Ven R Holalkere

Tomm Aldridge

Kristin L Weldon

Jason B Chesser

Brendan T Pavelek

Minh T D Le

Jeffory L Smalley

David Shia

Ralph V Miele

Sandeep Ahuja

Phil Geng

Casey R Winkel

Kenan Huseyin Arik

Robert Fite

Eric Dwight McAfee

Joseph Andrew Broderick

Marc Milobinski

Aaron P Anderson

Fernando Gonzalez Lenero

Carlos Alvizo Flores

Juan G Cevallos

Annie Chen

Eric D Mcafee

Jun Zhang

Devdatta P Kulkarni

Jin Yang

Mark J Gallina

Bijoyraj Sahu

Eric W Buddrius

Brian S Jarrett

Prabhakar Subrahmanyam

Catharina Biber

Ying-Feng Pang

Michael Berktold

Emery E Frey

Yi Xia

Victor Polyanko

Mike G Macgregor

Mark J Luckeroth

Yuyang Xia

Javier Avalos Garcia

Lianchang Du

Thu Huynh

Mark Bianco

Yuehong Fan

David Rodriguez

Jaime A Sanchez

Luz Karine Sandoval Granados

Michelle Goeppinger

Jessica Gulbrand

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes an electronic component to be plugged into an electronic system. The electronic component includes a housing. The housing includes a jam. The jam is to push through a first opening in a bottom of the housing and a second opening in a surface when the first and second openings are at least partially aligned. The surface is a mechanical component of the electronic system that the electrical component is to slide upon when being plugged into the electronic system. The jam includes tooth edges to engage with an edge of the second opening.

Jam for integration reliability of ruler form factor component

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.

Liquid coolant based thermal energy management for containers receiving pluggable circuit modules

Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

System to reduce coolant use in an array of circuit boards

Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Mechanism with folded wrapping to seal components immersed in coolant

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Expansion card having synergistic cooling, structural and volume reduction solutions

A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Modular capillary pumped loop cooling system

A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Frame-level thermal interface component for transfer of heat from an electronic component of a computer system

According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first contact surface and a second electrical component coupled to transmit heat to the second contact surface.

Systems to cool multiple electrical components

An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

Baffles for high capacity air-cooling systems for electronics apparatus

An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can accommodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

Electronics rack assemblies and associated components

Growing community of inventors

Lakewood, WA, United States of America

Barrett M Faneuf