Learonal, Inc.

Barnet D Ostrow

Fred I Nobel

David N Schram

Lazaro Yoen

Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Limiting tin sludge formation in tin or tin-lead electroplating solutions

Limiting tin sludge formation in tin or tin/lead electroplating solutions

Tin lead electroplating solutions

The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

Bath and process for electroplating tin, lead and tin/alloys

A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90.degree. F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.

Process and electrolyte for electroplating tin, lead or tin-lead alloys

This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90.degree. F.

Process for electroplating tin, lead and tin-lead alloys and baths

This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Bath and process for plating lead and lead/tin alloys

Bath and process for plating tin, lead and tin-lead alloys

A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added:

Electrodeposition of tin, lead and tin-lead alloys

The method of preventing or inhibiting diffusion of a base metal into an electrodeposited gold layer on said base metal which comprises electrodepositing a barrier layer on the base metal comprising a tungsten-cobalt alloy or a tungsten-nickel alloy and subsequently electrodepositing gold on the alloy barrier layer. The invention also includes the use of chelating agents in tungsten-cobalt and tungsten-nickel plating baths.

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Roslyn, NY, United States of America

Barnet D Ostrow