Synopsys, Inc.

Baribrata Biswas

Mathew Koshy

Arthur Nieuwoudt

Beifang Qiu

Jiyoun Kim

Charles C Chiang

Byungwook Kim

Kishore Singhal

Goetz Leonhardt

Mahmoud Shahram

Qiushi Chen

Xiaoping Hu

Edhi Sutjahjo

Sergey Krasnovsky

Alex Gyure

A method and apparatus to provide a capacitance to a design an integrated circuit is described. In one embodiment, the method receive a layout of the integrated circuit and applying canonical hierarchical models to the layout, wherein the canonical hierarchical models include a first type canonical model to capture a first capacitance of a device having a plurality of first conductors and a second type canonical model to capture a second capacitance between at least a portion of the device and one or more second conductors of the integrated circuit. The method further includes determining a capacitance for the layout based on the applying.

Capacitance extraction for advanced device technologies

A technology specific information to design the integrated circuit is received. A plurality of canonical hierarchical models to capture an integrated circuit capacitance are created. The plurality of canonical hierarchical models includes at least a canonical model to capture a capacitance of a device having a plurality of conductors, and a canonical model to capture a capacitance between at least a portion of the device and one or more other conductors of the integrated circuit. The canonical hierarchical models can be applied to a layout of the integrated circuit. A capacitance for the layout can be determined based on the canonical hierarchical models.

One embodiment of the present invention provides a system that performs an RLC extraction for a three-dimensional integrated circuit (3D-IC) die. During operation, the system receives a 3D-IC die description. The system then transforms the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description. Next, for each 2D-IC die description in the set of 2D-IC die descriptions, the system performs an electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file. The system then combines the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description.

Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

One embodiment of the present invention provides a system for determining an electrical property for an interconnect layer. During operation, the system receives interconnect technology data which includes nominal parameter values for a first interconnect layer, and parameter-variation values which represent variations in the nominal parameter values due to random process variations. Next, the system receives an interconnect template which describes the geometry of a portion of a second interconnect layer. The system then determines electrical property data for the interconnect template using the interconnect technology data. The electrical property data can include a nominal electrical property value, and sensitivity values which represent the sensitivities of the nominal electrical property value to variations in the nominal parameter values. Next, the system stores the electrical property data and the interconnect technology data in a storage.

Method and apparatus for facilitating variation-aware parasitic extraction

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San Jose, CA, United States of America

Baribrata Biswas