Kaiam Corp.

Other

Avicenatech Corp.

T&s Communications Co., Ltd.

Broadex Technologies UK Limited

Bardia Pezeshki

John F Heanue

Dinh Ton

Lucas Soldano

Gideon Yoffe

Henk Bulthuis

Michael Sherback

Thomas Pierre Schrans

Charles Amsden

Jamie Stokes

Ramsey Selim

Robert Kalman

Alexander Tselikov

Cameron Danesh

Susannah Heck

Suresh Rangarajan

Owen Shea

Andrew Grant

Alice Liu

Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.

Optically-enhanced multichip packaging

A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Optical interconnect for switch applications

A switch module includes a switch integrated circuit (IC), a photonic integrated circuit (PIC), and a planar lightwave circuit (PLC). The PIC may include a plurality of light sources, an optical splitter, and a plurality of modulators. A dual MEMS may be used to align lens arrays, which may be used to couple light from the PIC to the PLC.

Optical module for terabit switch

Light from discrete red, blue, and green lasers are combined into a single output using a planar lightwave circuit (PLC). In some embodiments some light from an output of the PLC is reflected back to the lasers, and in some embodiments the reflected light is primarily of one of the red, green, or blue wavelengths. In some embodiments multiple lasers of slightly differing wavelengths are provided as light sources for some or all of the red, blue, and green light.

RGB combiner using MEMs alignment and PLC

A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

MEMS-based levers and their use for alignment of optical elements

A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.

Optical interconnect having optical splitters and modulators integrated on same chip

An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Micromechanically aligned optical assembly

An optical transceiver may include pairs of lasers, each laser of a particular pair generating light at the same wavelength and each pair of lasers generating light at different wavelengths. The light from the lasers may be demultiplexed onto a pair of outputs, with each output receiving light from different lasers of each pair of lasers.

QSFP double density module

An assembly of waveguide wavelength multiplexers and demultiplexers, together with continuous wave (CW) laser transmitters that interface to grating couplers on a silicon photonics chip, providing CW sources, multiplexed output and optionally multiplexed input, all using a single photonic lightwave circuit (PLC).

Planar lightwave circuit active connector

A transmitter assembly incorporating multiple laser diodes that are wavelength multiplexed together using a planar lightwave circuit, and where the multiplexer's transmission spectrum depends on temperature at the same rate as the laser diodes. This allows a design for lower loss in the multiplexer and therefore is more power efficient.

Multiple wavelength light-source with tracking multiplexer

Multiple broad area lasers are coupled to a planar lightwave circuit, where the waveguides come together to form a single wide emitting aperture. A tapered lens is used at the output of the planar lightwave circuit to transform the highly asymmetric mode into a conventional round mode. This configuration allows much higher 'brightness', allowing 10 or more 100 um wide broad area lasers to be coupled into a single 100 um core multimode fiber. This is considerably more efficient than the standard method of combining a single 100 um wide broad area laser to a 100 um core multimode fiber.

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Menlo Park, CA, United States of America

Bardia Pezeshki