Adesto Technologies Corporation

Bard Pedersen

Gideon Intrater

Derric Lewis

Stephen Trinh

Shane Charles Hollmer

Ishai Naveh

Paul Hill

John Dinh

Nathan Gonzales

An integrated module assembly can include: an optical integrated circuit having first and second optical devices; a PCB having first and second holes therein, where the optical integrated circuit is coupled upside down to a first side of the PCB; and first and second lenses coupled to a second side of the PCB, where the first and second sides of the PCB are opposite thereto; and where the first lens is in alignment with the first hole and the first optical device, and the second lens is in alignment with the second hole and the second optical device.

Integrated module assembly for optical integrated circuits

A method of controlling a read request can include: receiving, in a host device, the read request from a bus master, where the host device is coupled to a memory device by an interface; determining a configuration state of the read request; comparing an attribute of the read request against a predetermined attribute stored in the host device; adjusting the configuration state of the read request when the attribute of the read request matches the predetermined attribute; and sending the read request with the adjusted configuration state from the host device to the memory device via the interface.

Memory latency reduction in XIP mode

A method of controlling a memory device can include: receiving, by an interface, a write command from a host; beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of memory cells arranged in a plurality of array planes; receiving, by the interface, a read command from the host; reconfiguring the write operation in response to detection of the read command during execution of the write operation; beginning execution of a read operation on a second array plane in response to the read command; and restoring the configuration of the write operation after the read operation has at least partially been executed.

Concurrent read and reconfigured write operations in a memory device

A memory device can include: a memory array with memory cells arranged as data lines; an interface that receives a read command requesting bytes of data in a consecutively addressed order from an address of a starting byte; a first buffer that stores a first data line from the memory array that includes the starting byte; a second buffer that stores a second data line from the memory array, which is consecutively addressed with respect to the first data line; output circuitry configured to access data from the buffers, and to sequentially output each byte from the starting byte through a highest addressed byte of the first data line, and each byte from a lowest addressed byte of the second data line until the requested data bytes has been output; and a data strobe driver that clocks each byte of data output by a data strobe on the interface.

Read latency reduction in a memory device

A memory device can include: a non-volatile storage register configured to store an active reset polling enable bit that corresponds to a reset operation; a controller configured to control execution of the reset operation on the memory device; an operation completion indicator configured to provide a reset recovery indication external to the memory device when the reset operation has completed and the active reset polling enable bit is set; and a command decoder configured to receive a command to be executed on the memory device in response to the reset recovery indication.

Memory device alert of completion of internally self-timed power-up and reset operations

A method of controlling an ultra-deep power down (UDPD) mode in a memory device, can include: receiving a write command from a host via an interface; beginning a write operation on the memory device to execute the write command; reading an auto-UDPD (AUDPD) configuration bit from a status register; switching the interface to a Single SPI mode in response to the write command and the AUDPD configuration bit being set; completing the write operation on the memory device; automatically entering the UDPD mode upon completion of the write operation in response to the AUDPD configuration bit being set; and entering a standby mode upon completion of the write operation in response to the AUDPD configuration bit being cleared.

Automatic switch to single SPI mode when entering UDPD

A method of controlling a memory device can include: (i) receiving a first read command for a critical byte, where the critical byte resides in a first group of a memory array on the memory device; (ii) reading the critical byte from the memory array in response to the first read command, and providing the critical byte; (iii) reading a next byte in the first group; (iv) outputting the next byte from the first group when a clock pulse; (v) repeating the reading the next byte and the outputting the next byte for each byte in the first group; (vi) reading a first byte in a second group of the memory array, where the second group is sequential to the first group, and where each group is allocated to a cache line; and (vii) outputting the first byte from the second group when a clock pulse is received.

Support for improved throughput in a memory device

A device configured for WLCSP, can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to the test pad; and a second RDL path that connects the test pad to a solder ball. In another case, a device configured for WLCSP can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball. A wafer having devices configured for WLCSP, can include: a first device having a first pad; a second device having a test pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball.

Offset test pads for WLCSP final test

In one embodiment, a cached memory device can include: (i) a memory array coupled to a system address bus and an internal data bus; (ii) a plurality of data buffers coupled to a system data bus, and to the memory array via the internal data bus; (iii) a plurality of valid bits, where each valid bit corresponds to one of the data buffers; (iv) a plurality of buffer address registers coupled to the system address bus, where each buffer address register corresponds to one of the data buffers; and (v) a plurality of compare circuits coupled to the system address bus, where each compare circuit corresponds to one of the data buffers.

Cached memory structure and operation

A memory device can include: a memory array comprising a plurality of memory cells; an interface configured to receive a suspend command and first and second write commands from a host, where the second write command is of higher priority and follows the first write command; a status register configured to store an automatic resume enable bit; a memory controller configured to suspend, in response to the suspend command, a first write operation that is executing the first write command on the memory array; the memory controller being configured to execute a second write operation on the memory array in response to the second write command; and the memory controller being configured to resume the first write operation upon completion of the second write operation in response to the automatic resume enable bit being set.

Automatic resumption of suspended write operation upon completion of higher priority write operation in a memory device

A memory device operable in an ultra-deep power-down mode can include: a command user interface; a voltage regulator having an output that provides a supply voltage for a plurality of components of the memory device, where the plurality of components comprises the command user interface; a wake-up circuit that remains powered on even when the memory device is in the ultra-deep power-down mode; the memory device being operable to enter the ultra-deep power-down mode in response to receiving a first predetermined command that causes the output of the voltage regulator to be disabled to completely power down the plurality of components during the ultra-deep power-down mode; and the memory device being operable to exit the ultra-deep power-down mode in response to receiving one of a hardware reset command sequence, a reset pin assertion, a power supply cycling, and a second predetermined command.

Growing community of inventors

Fremont, CA, United States of America

Bard Pedersen