Joanneum Research Forschungsgesellschaft Mbh

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Hueck Folien Ges.m.b.h.

Fh-oö Forschungs and Entwicklungs Gmbh

Lufthansa Technik Ag

Hueck Folien Gesellschaft M.b.h.

Scio Holding Gmbh

Hueck Folien Gmbh

Institut Für Nanostrukturierte Materialien & Photonik Joanneum Research Forschungs- Gesellschaft Mbh

Barbara Stadlober

Michael Popall

Franz Padinger

Ruth Houbertz-Krauss

Klaus Schmidegg

Stephan Trassl

Sonja Landertshamer

Dieter Nees

Stephan Ruttloff

Gerhard Domann

Siegfried Bauer

Maria Belegratis

Volker Schmidt

Angelika Schmitt

Markus Postl

Ladislav Kuna

Anja Haase

Ursula Haas

Christian Rendl

Michael Haller

Martin Zirkl

Michael Steindorfer

Stefan Trassl

Valentin Satzinger

Andre Lintschnig

Patrick Greindl

Markus Leitgeb

Christoph Auner

André Lintschnig

Uta Helbig

Johannes GÖTZ

Philipp SCHÄFFNER

Jonas Groten

Markus Krause

Dirk Ide

Michael Heilmann

Andreas Gschwandtner

Gregor Scheipl

The invention relates to a lithographic process for embossing three-dimensional microstructures, which have oversized structure heights, in a photostructurable carrier material using an exposure device, wherein an oversized structure height has a height which exceeds the value of the maximum nominal penetration depth. The process comprises the following process steps:

Lithographic method for imprinting three-dimensional microstructures having oversized structural heights into a carrier material

In the case of an embossing lacquer based on a UV-polymerizable prepolymer composition containing at least one acrylate monomer, the prepolymer composition&#x2014;in addition to the acrylate monomer&#x2014;contains at least one thiol selected from the group: 3-Mercaptopropianates, mercaptoacetates, thioglycolates, and alkylthiols as well as potentially a surface-active anti-adhesive additive selected from the group of anionic surfactants, such as polyether siloxanes, fatty alcohol ethoxylates, such as polyoxyethylene (9) lauryl ethers, monofunctional alkyl (meth)acrylates, polysiloxane (meth)acrylates, perfluoroalkyl (meth)acrylates, and perfluoropolyether (meth)acrylates as well as a photoinitiator, as well as a method for imprinting substrate surfaces coated with an embossing lacquer.

Embossing lacquer and method for embossing, and substrate surface coated with the embossing lacquer

With a prepolymer composition containing at least one mono or oligomer component with at least one polymerizable C&#x2014;C double bond as well as at least one multifunctional monomer component, the multifunctional monomer component a multifunctional monomer component is contained with at least two thiol groups selected from the group: 3-Mercaptopropionates, 3-Mercaptoacetates, thioglycolates, and alkylthiols, wherein the mono or oligomer component with at least one polymerizable double bond is selected from the group acrylates, methyl acrylates, vinyl ethers, allyl ethers, propenyl ethers, alkenes, dienes, unsaturated esters, allyl triazines, allyl isocyanates, and N-vinyl amides, and wherein at least one surface-active anti-adhesive additive selected from the group alkyl (meth)acrylates, polysiloxane (meth)acrylates, perfluoroalkyl (meth)acrylates, perfluoropolyether (meth)acrylates, alkyl vinyl ethers, polysiloxane vinyl ethers, perfluoroalkyl vinyl ethers, and perfluoropolyether vinyl ethers, as well as a photoinitiator are contained, as well as the use thereof.

Poly- or prepolymer composition, or embossing lacquer comprising such a composition and use thereof

The invention relates to a security element, comprising a thermoplastic or photo-sensitive replication lacquer layer, non-periodic randomly arranged (randomized) structures in the sub-micrometer range being incorporated into the replication lacquer layer and having an angle-independent optical effect, such as a color effect, and to a method for the production thereof and to the use thereof.

Security element and method for producing a security element having light-scattering structures

There is provided an sensing device, comprising: a substrate; a sensor ink printed onto the substrate; a conductive polymer ink printed onto the sensor ink; a conductive carbon paste formed on the polymer ink; and a conductive silver ink printed on the conductive carbon paste. There is also provided a sensing device for processing a signal generated by the input device, the sensing device comprising: an operational amplifier to amplify the signal; a filter to filter signal noise from the signal; an adder to apply an offset and attenuation to the signal; a microcontroller comprising an analog to digital converter to convert the signal into a digital output signal.

Printed piezoelectric pressure sensing foil

The invention relates to a semiconductor component having a metal-insulator structure (MIS) which contains as basic components a substrate, a layer made of an organic semiconductor material and a dielectric layer as insulator. The substrate and/or the dielectric layer made of an inorganic-organic hybrid polymer is chosen from these basic components. In addition, the invention relates to a method for the production of semiconductor components of this type and also to the use of inorganic-organic hybrid polymers for the production of semiconductor components.

Semi-conductor component, component, method for the production thereof and use of inorganic-organic hybrid polymers for producng semi-conductor components

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Graz, Austria

Barbara Stadlober