Stmicroelectronics S.r.l.

Maxim Integrated Products, Inc.

Hanking Electronics, Ltd.

Politecnico Di Milano

Barbara Simoni

Carlo Valzasina

Luca Coronato

Gabriele Cazzaniga

Giorgio Allegato

Lorenzo Corso

Alberto Corigliano

Claudia Comi

Angelo Merassi

Sarah Zerbini

Luciano Prandi

Mario Francesco Cortese

Attilio Frangi

Biagio De Masi

Andrea Rusconi Clerici Beltrami

Viola Fulvio

Angelo Antonio Merassi

A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

Microelectromechanical device with signal routing through a protective cap

A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.

Microelectromechanical device incorporating a gyroscope and an accelerometer

Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.

Recovery system and methods for MEMS devices

A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.

Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor

A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.

MEMS resonant accelerometer having improved electrical characteristics

The invention relates to a microelectro-mechanical structure (MEMS), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate. At least one elastic element is incorporated into a coupling structure that couples two stationary electrodes or couples a stationary electrode to at least one anchor. More than one elastic element may be incorporated. The number, locations, configurations and geometries of the elastic elements are adjusted to compensate an output offset and a sensitivity drift that are induced by the thermo-mechanical stress accumulated in the MEMS device.

Accelerometer with low sensitivity to thermo-mechanical stress

The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.

Micro-electromechanical structure with low sensitivity to thermo-mechanical stress

The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers.

Microelectromechanical z-axis out-of-plane stopper

A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.

Microelectromechanical three-axis capacitive accelerometer

A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.

Microelectromechanical z-axis detection structure with low thermal drifts

A microelectromechanical detection structure for a MEMS resonant biaxial accelerometer is provided with: an inertial mass, anchored to a substrate by elastic elements to be suspended above the substrate. The elastic elements enabling inertial movements of the inertial mass along a first axis of detection and a second axis of detection that belong to a plane of main extension of said inertial mass, in response to respective linear external accelerations. At least one first resonant element and one second resonant element have a respective longitudinal extension, respectively along the first axis of detection and the second axis of detection, and are mechanically coupled to the inertial mass through a respective one of the elastic elements to undergo a respective axial stress when the inertial mass moves respectively along the first axis of detection and the second axis of detection.

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Bareggio, Italy

Barbara Simoni