Thomson Components-mostek Corporation

Barbara R Mozdzen

Robert Henry Bond

Michael A Olla

Wayne A Mulholland

Jerry S Cupples

Linda S Wilson

Linn C Garrison

Steven Swendrowski

Daniel J Quinn

Ilya L Tsitovsky

Charles F Held

Yen T Nguyen

Quinn, Daniel J

A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

Integrated-circuit leadframe adapted for a simultaneous bonding operation

An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

Process of forming integrated circuits with contact pads in a standard

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Carrollton, TX, United States of America

Barbara R Mozdzen