Siemens Aktiengesellschaft

Siemens Nixdorf Informationssysteme Aktiengesellschaft

Siemens Aktiengesellscaft

Barbara Lehner

Heiner Bayer

Recai Sezi

Volker Plickert

Ernst Wipfelder

Michael Rogalli

Gregor Unger

Kurt Wohak

Oskar Wirbser

Ralf Carl

Hans-Peter Fritsch

UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 &mgr;m and a siloxane component are provided in addition to the casting resin formulation.

UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components

A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

One-component epoxy resin for covering electronic components

UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 .mu.m and a siloxane component are provided in addition to the casting resin formulation.

UV-hardenable and thermally hardenable epoxy resins for underfilling

An electrooptical module includes a converter and at least one optical wave guide having an end optically coupled to the converter through a coupling gap. The coupling gap is filled with a first light-permeable material. A second light-impermeable material protects an electrical circuit disposed in the immediate vicinity of the converter from outside light. The second material is equivalent in its basic chemical composition to the first material, but is modified in its optical properties for the sake of impermeability to light. At least one bonding wire serving to trigger the converter passes through the first and second materials.

Electrooptical module

A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.

Radiation-curable reaction resin system

UV-curable adhesive semiconductor chip mounting process

A drop coating compound in particular, for unhoused electrical and electronic circuits and components. The compound includes highly filled ultraviolet-curable epoxy resin compounds having improved properties with respect to their use and in comparison to previously used, predominantly two-component, thermally curable resins.

Growing community of inventors

Munich, Germany

Barbara Lehner