Seagate Technology Incorporated

Barbara J Ihlow-Mahrer

Wayne Allen Bonin

Barry Dean Wissman

Zine-Eddine Boutaghou

Roger Lee Hipwell, Jr

Lee Walter

Peter Crane

Brian Dufrene

A slider for carrying and finely adjusting both a radial position and a flying height of a transducing head with respect to a track of a rotatable disc includes a stator portion carried by a support structure such as a flexure of a disc drive system. A plurality of springs extend from the stator portion and are flexible in a lateral direction (for radial positioning) and in a vertical direction (for flying height control). A rotor portion is connected to the stator portion by the plurality of springs. The rotor portion carries the transducing head. The stator portion includes a plurality of stator electrodes, and the rotor portion includes a plurality of rotor electrodes suspended between the stator electrodes. Selected voltages are applied to the stator electrodes and the rotor electrodes to create a selected force in the lateral and vertical directions for moving the rotor portion with respect to the stator portion to finely adjust the radial position and flying height of the transducing head.

Transducer-level microactuator with dual-axis control

A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.

Laterally supported handle wafer for through-wafer reactive-ion etch micromachining

A method for fabricating an integrated coil-on-keeper assembly for use in a magnetic circuit to actuate a microactuator. The assembly is formed on a keeper substrate by patterning an insulator layer, plating at least one coil layer and patterning another insulator layer on top of each coil layer. The keeper substrate is etched to form the top keeper of the coil-on-keeper assembly.

Fabrication method for integrated microactuator coils

A microactuator is built at the slider level to achieve high resolution positioning of a transducing head with respect to a track of a rotatable disc having a plurality of concentric tracks in a disc drive system. The slider includes a main body carried by a flexure. A stator portion extends from the main body, and a plurality of beams extend from the stator portion, the beams being flexible in a lateral direction. A rotor portion is connected to the stator portion by the plurality of beams, forming a gap between the stator portion and the rotor portion. The rotor portion carries the transducing head. A plurality of stator electrodes are formed on the stator portion, and a plurality of rotor electrodes are formed on the rotor portion to confront the stator electrodes across the gap. Control circuitry applies selected voltages to the stator electrodes and the rotor electrodes to create a force in the lateral direction for moving the rotor portion with respect to the stator portion of the slider, thereby finely positioning the transducing head.

Slider-level microactuator for precise head positioning

A method for filling a trench extending through a microelectromechanical system (MEMS) device patterned on a wafer is disclosed. The method involves simultaneously depositing a trench-fill layer of insulating material over a first side of the wafer, over a second side of the wafer, and into the trench extending from the first side to the second side. Further, the width of the trench at the first side of the wafer and/or the second side of the wafer is variable to adjust the rate at which the trench fills.

Double-sided trench fill for electrical isolation of microelectromechanical system structures

Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.

Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag

A microactuator suspension supports a slider. The microactuator suspension has at least a first resilient support extending from a slider attachment pad to a suspension arm attachment pad. The slider attachment pad forms a clip which contacts the slider on side faces of the slider, and the microactuator adds little or nothing to the vertical thickness of the head gimbal assembly. The suspension arm attachment pad attaches to the gimbal with an attachment bridge which is longitudinally balanced relative to the gimbal point and relative to the air bearing centroid of the slider. The resilient supports may be beams having ends which are longitudinally spaced relative to the gimbal point, to the air bearing centroid, and to the attachment bridge to minimize moments and localized stresses on the beams. Dual beam and multiple beam arrangements are provided.

Growing community of inventors

Crystal, MN, United States of America

Barbara J Ihlow-Mahrer