Compal Electronics, Inc.

Bar-Long Denq

Chun-Ping Li

Jyh-Chyang Tzou

Chih-Wen Chiang

Chien-Chu Chen

Yuan-Ping Chu

Hung-Jen Chen

Chen-Hua Liu

Tsai-Wen Mao

Ru-Jen Chiu

Kuang-Cheng Fan

Chien-Chun Wu

A shell structure including a casing and a frame is provided. The casing includes an elastic material structure and a fiber structure, wherein the fiber structure is intermixed with the elastic material structure, and the casing has at least two sides adjacent to each other. The frame is wrapped by the casing, wherein the casing and the frame have at least one buffering space therebetween, and the buffering space is aligned to a border between the two sides. In addition, a manufacturing method of the shell structure is also provided.

Shell structure and manufacturing method thereof

A cover adapted to an electronic device is provided. An outer side of the electronic device has a connection port. The cover includes a first covering structure and a second covering structure. The first covering structure is disposed on the outer side and has a plurality of first openings. The second covering structure is connected to the first covering structure and has a second opening. The second opening is aligned to the connection port, and the second opening is separated from the first openings. A connector is adapted to be inserted into the connection port through the second opening.

Cover and electronic device having the same

A covering film adapted to a keyboard module is provided. The covering film includes a semi-translucent layer. The semi-translucent layer has a plurality of first pressing regions and covers the keyboard module. The first pressing regions are aligned to a plurality of input regions of the keyboard module respectively, and each of the first pressing regions has a patterned indentation. In addition, an electronic device having the covering film is also provided.

Covering film and electronic device

An elastic cover, adapted to be disposed at a lateral side of an electronic device to cover at least a portion of a transmitting port, includes a body having two shielding sheets. Each shielding sheet includes a first portion close to the other shielding sheet and a second portion away from the other shielding sheet. A turn is formed between the first and the second portions so that a cross-section of the shielding sheet appears as a V shape. An opening of the V shape is adapted to face the lateral side. A slit is formed between the two shielding sheets and adapted to correspond to the transmitting port. A transmitting object is adapted to push the two first portions to enlarge the slit, so as to pass through the body and be plugged into the transmitting port. An electronic apparatus having the elastic cover is further provided.

Elastic cover and electronic apparatus

A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.

Transfer method using thermal transfer film

A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.

Protective sheet and method for manufacturing the same

A gas sensor unit includes a conductive polymer and an absorbent for absorbing gas molecules. The conductive polymer is polyaniline (PAN) and the absorbent is polyurethane (PU). The content of the conductive polymer is 25-55 wt % and the content of the absorbent is 45-75 wt %.

Gas sensor unit and method of forming the same

A connector for transmitting electrical signals from a first board to a second board includes at least one conductive media. The conductive media includes a plurality of insulating layers and a plurality of conductive layers. Each conductive layer is formed between two insulating layers. The connector further includes a frame including at least one hollow space for accommodating the conductive media.

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Taipei, Taiwan

Bar-Long Denq