Shenzhen Goodix Technology Co., Ltd.

Baoquan Wu

Wei Long

Yuping Liu

Jianxiang Zhang

Jian Shen

Dan Li

Haoxiang Dong

Sichao Zhang

Ya Wei

Pan Gao

Hanjian Leng

Chenjin Liu

Xinfei Yu

Embodiments of the present application disclose a fingerprint identification apparatus and an electronic device, which can simplify an optical path laminated structure and processing process, thereby improving efficiency of mass production. The fingerprint identification apparatus includes: a fingerprint sensor chip; an infrared radiation cut filter layer provided above the fingerprint sensor chip; a light blocking layer provided on an upper surface of the infrared radiation cut filter layer by means of coating film, the light blocking layer being provided with a first hole array, and cross sections of holes in the first hole array being inverse trapezoid; a light transmitting dielectric layer including first color filter units, the first color filter units being formed in part of the holes in the first hole array to cover the part of the holes; and a microlens array provided above the light transmitting dielectric layer.

Fingerprint identification apparatus and electronic device

The present disclosure provides a package structure and a packaging method. The package structure provided by the present disclosure includes: a package base and a redistribution layer disposed on the package base; where the package base includes a plurality of device areas; and a channel set is provided in the device area, where the channel set is used to connect an electronic device, and the redistribution layer is used to lead a subset of to-be-protected channels that needs electrostatic protection in the channel set out to a preset area on the package base, so that all or part of channels in the subset of to-be-protected channels form a series circuit in the preset area, and the series circuit is used to connect with an electrostatic discharge end. The package structure of the present disclosure can provide electrostatic protection for the channel that needs to be protected during a packaging process.

Package structure and packaging method

A fingerprint identification apparatus and an electronic device are provided. The fingerprint identification apparatus is used to be disposed under a display screen of an electronic device, including: a sensor chip, where the sensor chip includes a light detecting array and a chip seal ring, and the chip seal ring is disposed around the light detecting array; a light shielding layer, formed on the light detecting array, where the light shielding layer is provided with a plurality of light passing apertures, and the light shielding layer covers an whole region of the light detecting array and at least covers partial region of the chip seal ring; and the fingerprint light signal, returned after reflection or scattering via a finger above the display screen, is transmitted to the light detecting array through the plurality of light passing apertures on the light shielding layer for fingerprint identification.

An embodiment of the present application discloses an optical fingerprint identification apparatus and an electronic device, which can improve performance of the optical fingerprint identification apparatus. The optical fingerprint identification apparatus includes: a light detection array; a filter layer, disposed above the light detection array, where the filter layer is integrated with the light detection array in a photosensor chip; a first light blocking layer formed above the filter layer, where the first light blocking layer is provided with a plurality of light passing holes; and a first microlens array disposed above the first light blocking layer, where the first microlens array is configured to converge the optical signal to the plurality of light passing holes of the first light blocking layer, and the optical signal is transmitted to the light detection array through the plurality of light passing holes of the first light blocking layer.

Optical fingerprint identification apparatus and electronic device

The present application provides an optical fingerprint apparatus and an electronic device, which could reduce a thickness of the optical fingerprint apparatus. The optical fingerprint apparatus is applied to an electronic device having a display screen and configured to be disposed under the display screen, and the optical fingerprint apparatus comprises: an optical fingerprint chip configured to receive a fingerprint detecting signal, wherein the fingerprint detecting signal is used to detect fingerprint information of a finger; and a filter structure, wherein the filter structure is deposited or sputtered on the optical fingerprint chip.

Optical fingerprint apparatus and electronic device

In semiconductor packaging technologies, a secondary packaging method of a TSV chip and a secondary package of a TSV chip are provided. The TSV chip has a forward surface and a counter surface that are opposite to each other, a BGA solder ball is disposed on the counter surface, and the secondary packaging method includes: placing at least one TSV chip on a base on which a stress relief film layer is laid; cladding the TSV chip via a softened molding compound; removing the base after the molding compound is cured, to obtain a secondary package of the TSV chip; and processing a surface of the secondary package to expose the BGA solder ball.

Secondary packaging method and secondary package of through silicon via chip

The present application provides a fingerprint identification module and a package structure of a fingerprint identification chip. The fingerprint identification module includes: a fingerprint identification chip and a package structure for packaging the fingerprint identification chip. The package structure leaves a fingerprint sensing region of the fingerprint identification chip exposed, an upper surface of a film layer of the fingerprint sensing region is provided with a protection layer with a predetermined thickness. The protection layer is exposed in the fingerprint sensing region outside the package structure and causes the fingerprint identification chip to have a predefined fingerprint identification distance. The fingerprint identification module and the package structure with a protection layer arranged on the upper surface of the fingerprint identification chip provide sufficient protections for fabrication processes such as downstream module assembly, while ensuring that the fingerprint identification chip has a predefined fingerprint identification distance.

Fingerprint identification module and package structure of fingerprint identification chip

A fingerprint identification apparatus, a method for fabricating a cover and a terminal device are provided. A plurality of optical channels are arranged in the body of the cover, such that the light reflected by an object to be identified is as much as possible linearly transmitted to the photosensitive region in the image identification chip and the intensity of the light received by the image identification chip is maximized. This is favorable to form a clear image, and thus the precision of fingerprint identification of the fingerprint identification apparatus is improved. In addition, in the fingerprint identification apparatus, under the condition of satisfying the signal penetration rate, the cover may be as thick as possible, to further enhance the strength and reliability of the cover.

Method for fabricating fingerprint identification apparatus

Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

Optical module, fabrication method thereof, and terminal device using the same

A chip packaging structure and method, and an electronic device, are provided. The chip packaging structure includes a support, a chip, at least one conductor, and a package for plastic packaging the support, the chip and the conductor. The chip is arranged on an upper surface of the support, a chip pad is formed on the upper surface of the chip, and the chip pad is connected to an external pad of the support by a bonding wire. The conductor is connected to the external pad or a ground pad of the chip pad, and the shortest distance from the conductor to the upper surface of the package is less than the shortest distance from the bonding wire to the upper surface of the package, whereby chip failure caused by static electricity discharge is greatly reduced.

Chip packaging structure and method, and electronic device

The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.

Fingerprint identification module and method for manufacturing the same

The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body. In addition, the multi-chip redistribution technology can also greatly narrow down an interconnection distance between chips, which improves efficiency of communication between chips.

Growing community of inventors

Shenzhen, China

Baoquan Wu