Intel Corporation

Advanced Micro Devices Corporation

Baomin Liu

James Utz

Eduardo Escamilla

Jeff Ku

Kannan G Raja

Tongyan Zhai

Samuel D Naffziger

Min Suet Lim

Mark Charles Carbone

Ralph V Miele

Prakash Kurma Raju

Juha Paavola

Vivek Paranjape

Todd W Steigerwald

Prasanna Pichumani

Gavin Sung

Daniel J Ragland

Maxat Touzelbaev

Gustavo Fricke

Arnab Sen

Justin Michael Huttula

Hua Yang

Andrew Larson

Lance Lin

Gokul V Subramaniam

Kathiravan D

Jason Y Jiang

Xiyong Tian

James M Yoder

Columbia Mishra

Gopinath Kandasamy

Jia Yan Go

Ruander Cardenas

Twan Sing Loo

Christopher M Moore

Drew G Damm

Hari Shanker Thakur

Evan Piotr Kuklinski

Meenakshi Gupta

Gerry Juan

Venkat R Gaurav

Ritu Bawa

Rob W Sims

Brian R Peil

Chin Kung Goh

Javed Shaikh

Ricky O Branner

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Cora Nien

Linden H McClure

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Linden H Mcclure

Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Thermal solutions for cooling electronic devices

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

System and method to help mitigate heat in an electronic device

Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.

Thermal cooling system

Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.

Docking systems and methods for electronic devices

Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.

Mobile device cooling and performance management

An integrated circuit includes a multiple number of processor cores and a system management unit. The multiple number of processor cores each operate at one of a multiple number of performance states. The system management unit is coupled to the multiple number of processor cores, for setting performance states of the multiple number of processor cores. The system management unit boosts a first performance state of a first processor core of the multiple number of processor cores based on both a first temperature calculated from an estimated power consumption, and a second temperature based on a temperature measurement.

Performance state boost for multi-core integrated circuit

Various EMI shields with thermal management capabilities are disclosed. In one aspect, an EMI shield is provided that includes a thermal spreader plate adapted to be seated on and convey heat from an electromagnetic emissions generating component. The thermal spreader plate has a first material composition and a shield effectiveness that is absorption dominant to electromagnetic waves at a given electromagnetic emissions frequency. The EMI shield also includes a shell to cover and reflect electromagnetic emissions from the electromagnetic emissions generating component. The shell has a second material composition different than the first material composition and a shield effectiveness that is reflection dominant to electromagnetic waves at the given electromagnetic emissions frequency.

Combined electromagnetic shield and thermal management device

Growing community of inventors

Austin, TX, United States of America

Baomin Liu