Delphi Technologies, Inc.

Aptiv Technologies Limited

Hughes Aircraft Company

Bao Q Le

Eric James Smoll

Haim Feigenbaum

Chris M Schreiber

Gerald A Rhinehart, Jr

Scott P Cohen

Christopher M Schreiber

Joon Lee

Eric Dean Jensen

Alan L Kovacs

James Shuster

Gerald P Chernicky

Robert K Betz

Long T Hoang

Termini assemblies of electrical cable connector assemblies and methods of formation include a termini housing configured to receive an electrical cable and a dynamic seal assembly disposed in the termini housing and including a first portion having an O-ring seal configuration and configured to seal the termini assembly up to a pressure threshold and a second portion having a cup seal configuration and configured to seal the termini assembly at pressures greater than the pressure threshold. Methods of installing the electrical cable connector assemblies include installing the electrical cable connector assembly in a low or high pressure application, wherein installation in the low pressure application results in at least one of the first and second portions of the dynamic seal assembly sealing the termini assembly, and wherein installation in the high pressure application results in the second portion of the dynamic seal assembly sealing the termini assembly.

Dynamic contact and fiber optic termini cavity to wire removable seals

An electrical connector assembly includes a connector body that is formed of a first dielectric material defining a terminal cavity configured to receive an electrical terminal. The connector body defines a chamber that is separate from the terminal cavity. The chamber contains a second dielectric material that has a lower dielectric constant property than the first dielectric material, such as air. The connector body may be formed by as additive manufacturing process, such as 3D printing, stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, and laminated object manufacturing.

Electrical connector with dielectric properties suitable for high speed data transmission

An electrical connector assembly includes a connector body having a plurality of terminal receiving cavities formed therein and a plurality of flexible retaining arms integrally formed with a cavity wall and projecting from the cavity wall into the terminal receiving cavity toward a centerline of the terminal receiving cavity. The retaining arm defining a lock surface extending from a first free end of the retaining arm in a direction toward the centerline of the terminal receiving cavity. The assembly also includes a plurality of terminals having an end configured to connect with a corresponding mating terminal and a second end configured to be secured to a wire. The end defines a lock edge. The terminal is received in the terminal receiving cavity such that the first lock surface and the second lock surface engages the lock edge, thereby inhibiting the terminal from being withdrawn from the terminal receiving cavity.

Electrical connector assembly

A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Flexible circuit with micro-sized probe tips and a method of making the same

A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Stress relief bend useful in an integrated circuit redistribution patch

A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated through the cladded substrate. A copper core is deposited within the vias to thereby connect the two claddings. A photoresist is applied to both claddings, a photomask having a predetermined exposure pattern is placed over the claddings, the photoresist is exposed to ultraviolet (UV) light to thereby polymerize in the exposed areas thereof, and the resulting photoresist image is developed by use of a developer solution to wash away of the unpolymerized areas of the photoresist. Now, the photoresist image provides a retainer wall spaced from, and circumferentially around, the vias. Next, a lead-tin solder alloy is electroplated, such as by a lead-tin fluoroborate bath, at the vias into the volumes defined by the retainer wall at each end of the vias. Now, the photoresist is stripped, such as by an alkali stripper, from the cladding, leaving behind a pair of solder deposits at each via. Next, the copper cladding is etched away using an ammonia based etchant, wherein the solder deposits are left intact. Finally, the solder deposits are subjected to reflow, whereupon the solder deposits form a pair of generally convexly shaped bumps connected to the copper core. In the preferred environment of practice, the bumps form a column grid array pattern arranged on an electronic device.

Column grid array for flip-chip devices

A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

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Santa Ana, CA, United States of America

Bao Q Le