Cisco Technology, Inc.

Bangalore J Shanker

Mudasir Ahmad

Mohan R Nagar

Kuo-Chuan Liu

Jie Xue

Ashwath Nagaraj

Sergio D Camerlo

Yida Zou

Wheling Cheng

Suryaprakash Jonnavithula

A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Method and apparatus for supporting a computer chip on a printed circuit board assembly

To minimize the warpage of an organic substrate that supports at least one electrical hardware component (e.g., a system-in-package module), a bottom surface of a lid is attached to a top surface of the electrical hardware component. The lid includes a leg that extends from the bottom surface of the lid towards a top surface of the substrate. A portion of the leg closest to the substrate may move relative to the substrate. As the lid warps, the lid does not also cause distortion of the substrate. The leg may be a flange that extends at least a portion of the width or at least a portion of the length of the lid, may be a post located at the perimeter of the lid, or may be any other portion extending from above the electrical component towards the substrate.

Lid for an electrical hardware component

A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assembly, located within the defined space, has a relatively high thermal conductivity, compared to other thermally conductive materials, and transfers heat from the circuit board component to the support plane or carrier tray associated with the circuit board. The heat pipe assembly has an input portion that contacts the circuit board component and an output portion that contacts the support plane. The heat pipe assembly also has a compliant portion having a lower stiffness relative to the stiffness of either the input portion or the output portion. The compliant portion of the heat pipe assembly allows for displacement of the input portion relative to the output portion to limit the amount of stress generated by the heat pipe assembly on the circuit board component.

Methods and apparatus for cooling a circuit board component using a heat pipe assembly

A surface mount adaptor allows for removable attachment of debugging connectors to a circuit board and provides high density access to the circuit board under test at a single location. A circuit board testing assembly has a support member having debugging connectors coupled to a first surface of the support member, the debugging connectors being configured to attach to a circuit board testing device. The circuit board testing assembly also has a support member connector coupled to a second surface of the support member and in electrical communication with the debugging connectors. The support member is configured to removably attach to a circuit board connector surface mounted to a first surface of a circuit board. Removable attachment of the debugging connectors from the circuit board provides an availability of space on the top side of the circuit board for additional circuit board components and traces.

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Fremont, CA, United States of America

Bangalore J Shanker