Samsung Electronics Co., Ltd.

Bang-weon Lee

Oh-Dal Kwon

Jin-Sung Lee

Dong-Woo Lee

Tae-Gyu Kim

Tae-sang Park

Jeong-Hwan Song

Seung-Wan Lee

Sun-Tae Jung

In-Jae Lee

Tae-gyu Kim

Sang-Wook Yoo

Jae-sung You

Sang-Gil Shin

Jong-Kil Park

Sung-Uk Zhang

Jong-kill Lim

Shin-Young Yoon

Kyong-Shik Lee

Myong-Won Kim

Joon-Yong Cho

Young-Gyu Son

A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

Light-emitting device package

Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

Heat treatment apparatus

An athermal arrayed-waveguide grating is disclosed and includes an input waveguide for inputting two or more optical signals from one exterior side, a grating array for separating the optical signals into different wavelengths of light, a first slab, formed with two layers and having different refractive indices from each other, for connecting the input waveguide with the grating array, a second slab for causing the different light wavelengths separated at the grating array to be imaged on an egress surface thereof, and an output waveguide array for outputting each light wavelength imaged on the egress surface of the second slab to the other exterior side in the form of a separated channel.

Athermal arrayed waveguide grating

A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

Wafer bake apparatus

Disclosed is a variable alignment-type optical fiber block in which alignment of waveguides can be changed according to temperature. The optical fiber block includes: a substrate having a receiving section formed at one end of the substrate, the receiving section having a predetermined volume; a ferrule seated in the receiving section, the ferrule having a hole in which an optical fiber is inserted; a first expandable block disposed between one side surface of the ferrule and an inner wall surface of the receiving section, which are opposed to each other, the first expandable block having a first thermal expansive coefficient; and, a second expandable block disposed between the other side surface of the ferrule and another inner wall surface of the receiving section, which are opposed to each other, the second expandable block having a second thermal expansive coefficient.

Variable alignment-type optical fiber block

There is provided a packaging unit for an optical fiber array using a planar lightwave circuit (PLC). An optical fiber array is fixed within a housing. The housing has first and second slots formed to face each other on the side periphery, and each of the first and second slots has opened ends to make the inner and outer walls of the housing communicate with each other. An optical fiber of the optical fiber array is inserted through first and second boots and then the first and second boots are inserted in the first and second slots of the housing.

Packaging unit for optical fiber array

Growing community of inventors

Seoul, South Korea

Bang-weon Lee