Seoul Semiconductor Co., Ltd.

Bang Hyun Kim

Eun Jung Seo

Jae Ho Cho

Jae Ho Lee

Jong Min Lee

Jung Hwa Jung

Seoung Ho Jung

Eui Sung Jeong

Young Hye Seo

Eun Ju Kim

Young Eun Yang

Hyouk Won Kwon

Chung Hoon Lee

Kwang Il Park

Yoon Hee Kim

Byung Yeol Park

A light device including a substrate, and first and second light emitters spaced apart from each other, and a power source to control the first light emitter and the second light emitter, in which the first and second light emitters include a light emitting region, a wavelength conversion layer disposed on the light emitting region, and a lateral reflection layer covering a region of a side of the light emitting region and the wavelength conversion layer, the first light emitter and the second light emitter are configured to output the same or different magnitudes of power by receiving the same or different magnitudes of current, the first and second light emitters are respectively configured to emit first light and second light, the first light emitter is electrically connected to the second light emitter through a common electrode.

Light emitting diode and light emitting module comprising the same

A light emitting module including a substrate, a first light emitter and a second light emitter disposed on the substrate and spaced apart from each other, an isolation layer disposed between the first and second light emitters, and a light diffusion layer and a wavelength converter disposed on the first and second light emitters, in which the first and second light emitters include first and second light emitting regions spaced apart from each other, respectively, the wavelength converter includes a first wavelength conversion layer covering the second light emitting region, and a second wavelength conversion layer covering the first light emitting region, the light diffusion layer covers an upper surface of the first and second wavelength conversion layers, and a region between the first and second wavelength conversion layers has an area vertically overlapped with the isolation layer.

Light emitting module

A light emitting device including a substrate, a light emitting structure disposed on the substrate and having a first light emitting region, a second light emitting region, and a third light emitting region, and an insulation layer to block unintended electrical connection between the first light emitting region and the second light emitting region, or between the second light emitting region and the third light emitting region, in which each of the first light emitting region, the second light emitting region, and the third light emitting region comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, and a center of the first light emitting region overlaps a center of the second light emitting region and a center of the third light emitting region.

A light emitting module including a substrate, a first light emitting part disposed on the substrate, and a second light emitting part disposed on the substrate and spaced apart from the first light emitting part by an isolation trench between the first and the second light emitting parts, in which the first light emitting part and the second light emitting part include a first light emitting region and a second light emitting region, respectively, the second light emitting region being spaced apart from the first light emitting region, each of the first and second light emitting parts further includes a wavelength conversion layer covering the first and second light emitting regions, the wavelength conversion layers further include a barrier layer, and the isolation trench and the barrier layer vertically overlap each other on the base substrate.

A light emitting module including a base substrate, a first light emitting diode disposed on the base substrate, and a second light emitting diode disposed on the base substrate and spaced apart from the first light emitting diode, in which each of the first light emitting diode and the second light emitting diode includes a first light emitting region and a second light emitting region, the second light emitting region being spaced apart from the first light emitting region and surrounding the first light emitting region.

A light emitting diode including a first light emitting region, and a second light emitting region spaced apart from and surrounding the first light emitting region, in which the first light emitting region and the second light emitting region are configured to be independently operated.

A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Light emitting device

A light emitting module includes a light emitting diode chip and a lens. The lens includes a lower surface having a concave portion. The lens also includes an upper surface from which light incident on the concave portion is emitted. The upper surface of the lens includes a concave surface positioned in a central axis thereof. The concave portion of the lower surface includes at least one of a surface perpendicular to the central axis and a downwardly convex surface. At least one of the surface perpendicular to the central axis and the downwardly convex surface is positioned in a region narrower than an entrance region of the concave portion.

Light emitting module and lens

A lens including an upper surface having a curved portion having a changing curvature in a direction extending away from a central axis of the lens, and a lower surface having a concave portion disposed on the central axis of the lens. The concave portion of the lower surface includes an entrance disposed on a lower region of the concave portion and configured to receive light emitted from a light-emitting diode chip, and an upper end surface disposed on an upper region of the concave portion. The concave portion includes a width that narrows in a direction extending away from the entrance. The upper end surface is nonplanar.

A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.

Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the same

A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Light emitting diode package

A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

LED package with lead terminals having protrusions of differing widths and method for fabricating the same

A light-emitting device includes a board, a light-emitting diode chip disposed on the board, a molding part disposed on the board and covering the light-emitting diode chip, and a lens cap disposed on the board that is coupled with the substrate thereon and covering the molding part. An air gap is disposed between the lens cap and the molding part.

Light emitting device and electronic apparatus including the same

A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Growing community of inventors

Ansan-si, South Korea

Bang Hyun Kim