Intel Corporation

Balu Pathangey

Paul J Gwin

Je-Young Chang

Ravi S Prasher

Mihir A Oka

Choong-Un Kim

Andrew Proctor

Mark E Luke

Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.

Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material

A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is especially effective for silicon and aluminum, among other materials. The corrosion protection may be enhanced for certain materials by adding benzotriazole in a third concentration to the potassium formate solution.

Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same

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Socttsdale, AZ, United States of America

Balu Pathangey