Osram Gmbh

Osram Gesellschaft MIT Beschraenkter Haftung

Infineon Technologies Ag

Osram Ag

Ledvance Gmbh

Osram Beteiligungsverwaltung Gmbh

Bakuri Lanchava

Robert Kraus

Wolfgang Pabst

Henning Rehn

Jan Oliver Drumm

Tobias Frost

Steven Wetzel

Michael Wolfsteiner

Michael Ahr

A light-emitting unit having a lighting unit () and a projection unit (), in which the lighting unit and the projection unit adapted to be switched on and off independently of one another.

Light unit comprising an illumination unit and a projection unit

A method for operating an LED lighting device (L), wherein the LED lighting device comprises: at least two color channels (Ch, Ch, Ch), wherein each color channel (Ch, Ch, Ch) comprises at least one LED (LD, LD, LD), wherein the LEDs (LD, LD, LD) of a color channel (Ch, Ch, Ch) each have the same color, and wherein each color channel (Ch, Ch, Ch) is able to be activated separately, and at least one photodetector (D), which is configured and arranged to detect a portion of the light radiated by the LEDs (LD, LD, LD), wherein the method comprises the steps of: switching over the LED lighting device (L) from an operating phase (BP) into a measurement phase (MP); and temporally consecutive activation of the color channels (Ch, Ch, Ch) so that a light radiated during the measurement phase (MP) by the LEDs (LD, LD, LD) has an integral mixture which substantially corresponds to a color mixture of the operating phase.

LED lighting device and method for operating an LED lighting device

In a method for projecting an image onto a projection area () by at least one first () and second () beam, in order to create an improved image on the projection area, the deviation of the projection of the first and second beam on the projection area is determined, and the intensity of the first and/or second beam is varied over time according to the previously determined deviations.

Projection apparatus having improved projection properties, and method and procedure, respectively, for projecting an image

Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate nearly to an upper surface of the filler layer. In some embodiments of electronic packages, the through contacts separated from the heat sink by a trench cut into the upper surface of the filler layer, the through contacts intersecting one wall of the trench and the heat sink intersecting the other wall of the trench an electronic semiconductor package. A method of forming the package and a lead frame are also disclosed.

Semiconductor device package and methods for producing same

A light-emitting module may include at least one receiver configured to wirelessly tap off energy from an alternating field, and at least one light source, which is connected to the receiver for tapping off electrical power, wherein the at least one light-emitting module is surrounded at least partially by a protective housing, wherein the light-emitting module is self-aligning.

Wireless supplyable lighting module

An LED lamp may include at least one support equipped with at least one LED, a lamp base, at least one circuit component, interposed between the lamp base and the at least one LED, for operating the at least one LED, and a lamp body made of optically transmissive material with a recess for holding at least that part of the support which carries the at least one LED, the lamp body having surface structuring for cooling by thermal convection, wherein the surface structuring comprises a multiplicity of elevations, and wherein the elevations are respectively designed in the form of islands.

Growing community of inventors

Wuppertal, Germany

Bakuri Lanchava