Samsung Electronics Co., Ltd.

Baikwoo Lee

Youngjae Kim

Jaegwon Jang

Boin Noh

HyunSuk Chun

Jeongwon Yoon

A printed circuit board includes chip regions on which semiconductor chips are mounted, and a scribe region surrounding each of the chip regions. The scribe region includes first vent holes that are configured to receive a flow of molding resin and are arranged along a first direction corresponding to a flow direction of the molding resin.

Printed circuit board

Provided is a semiconductor package and a method of making same, including a first package substrate; a first semiconductor chip mounted on the first package substrate and having a first pad and a second pad, wherein the first pad is provided on a top of the first semiconductor chip and the second pad is provided on a bottom of the first semiconductor chip, the bottom being an opposite surface of the top; and a clad metal provided on the first pad and electrically connecting the first semiconductor chip to one of a second semiconductor chip and second package substrate provided on the top of the first semiconductor chip.

Growing community of inventors

Gwangmyeong-si, South Korea

Baikwoo Lee