Siemens Medical Solutions Usa, Inc.

Baik Woo Lee

Stephen Roy Barnes

KyungHo Lee

YoungShin Kim

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Chip-on-array with interposer for a multidimensional transducer array

For direct chip-on-array for a multi-dimensional transducer array, the generally rigid and conductive dematching layer is extended beyond a footprint of the transducer array. The ASIC is directly connected to the dematching layer on one side, while the other side provides for electrical connection to the elements of the array and I/O pads for connections (e.g., flex-to-dematching layer) to the ultrasound imaging system. By using the dematching layer rigidity, the ASIC may be protected during formation of the acoustic stack. By using the dematching layer conductivity, any mis-alignment is compensated by the routing through the dematching layer, and/or a large flat region is provided for I/O, allowing for good low temperature asperity contact connections with larger area than flip-chip solder bumps. By providing the I/O for the system connections on a different side of the dematching layer than the ASIC, a large keep-out distance due to underfill may be avoided.

Direct chip-on-array for a multidimensional transducer array

An ultrasound transducer used in an ultrasound system and a method of manufacturing the same are disclosed. The ultrasound transducer is manufactured by forming a backing block including a plurality of surfaces; forming a piezoelectric layer including a first portion formed on the backing block to be in contact therewith and a second portion extending from the first portion; electrically connecting a plurality of pins to the second portion by attaching a connector having the plurality of pins for electrical connection with at least one of a transmitting unit and a receiving unit of an ultrasound system to at least one surface of the plurality of surfaces of the backing block; cutting the first portion and the second portion of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; and forming a ground layer connected to the piezoelectric layer.

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Issaquah, WA, United States of America

Baik Woo Lee