Henkel Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Loctite Corporation

Bahram Issari

Robert P Cross

Jiangbo Ouyang

Lester D Bennington

Wenhua Zhang

John Gregory Woods

Hsien-Kun Chu

Thomas Fay-Oy Lim

Shengqian Kong

Yayun Liu

Philip L Kropp

Stephen Hynes

Mathias E Liistro, Jr

John W Kerr

Chunyu Sun

Alfred A DeCato

Lynnette M Hurlburt

Darel L Gustafson

Chiu-Sing Lin

Christina Despotopoulou

Michael Levandoski

Debora E Duch

Rudolf Oldenzijl

Richard Corrao

Inge Van Der Meulen

Tianzhi Zhang

Li Kang

Douglas N Horner

Michael Paul Levandoski

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Debondable compositions

Curable compositions that undergo reaction induced phase separation of domains in cured matrix and provide beneficial physical and chemical properties and methods of use of such compositions. Curable compositions that undergo reaction induced phase separation of domains in cured matrix in response to a first set of curing conditions and the domains undergo a second reaction in response to a second set of curing conditions to improve the physical properties of the domains and the cured composition, such as improvements in glass transition temperature and thermal degradation.

Curable compositions for production of reaction induced phase separated compositions with improved properties

Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

Stretchable electrically conductive ink compositions

Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Reactive resins and formulations for low refractive index and low dielectric constant applications

The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

1K UV and thermal cure high temperature debondable adhesive

This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.

Polysiloxanes grafted with radically curable and/or moisture curable groups

The present invention provides moisture curable polyacrylate compositions, which cured elastomers thereof demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids such as transmission fluids and oil and fuel based fluids. Such compositions include:

Shrinkage-resistant polymers

The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility.

UV and UV/moisture dual curable compositions with improved cure through volume

The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.

Reactive polyorganosiloxanes having controlled molecular weight and functionality

Room-temperature vulcanized (RTV) foaming compositions are disclosed. The compositions include at least one enoxysilyl functional group and/or at least one alkoxysilyl functional group, at least one amine catalyst, and at least one silicon hydride functional group. Also disclosed are methods of preparing such compositions and methods of using such compositions, methods for making a gasket, and articles of manufacture.

Foaming RTV silicone compositions

A room temperature vulcanizing silicone polymer composition including:  Enhanced elongation ability is possessed by these compositions.

Highly elongated single component, non-corrosive RTV silicone compositions

The present invention relates to curable elastomer compositions and deformable thermoplastic compositions which are reshapable subsequent to cure or solidification. In particular, the present invention relates to compositions and articles of manufacture which are prepared from curable elastomeric or deformable thermoplastic matrices having distributed therein polymeric powders which have a melting point below the degradation of the matrix and which are present in shape-holding amounts to permit reshaping subsequent to elastomer cure.

Reformable compositions

Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

Growing community of inventors

Glastonbury, CT, United States of America

Bahram Issari