International Business Machines Corporation

Globalfoundries Inc.

King Abdulaziz City for Science and Technology

Elpis Technologies Inc.

Bahman Hekmatshoartabari

Davood Shahrjerdi

Alexander Reznicek

Ghavam G Shahidi

Devendra K Sadana

Stephen W Bedell

Karthik Balakrishnan

Tak H Ning

Ali Afzali-Ardakani

Tze-Chiang Chen

Jeng-Bang Yau

Ali Khakifirooz

Pouya Hashemi

Takashi Ando

Kevin K Chan

Kailash Gopalakrishnan

Anirban Basu

Ruilong Xie

Ning Li

Joel Pereira De Souza

Nanbo Gong

Wilfried Haensch

Fabio Carta

Keith E Fogel

Jeehwan Kim

Matthew Joseph BrightSky

Daniel Michael Kuchta

Chung H Lam

Jingyun Zhang

Jeremy R Fox

Martin G Keen

Katherine Lynn Saenger

Stephen McConnell Gates

Siegfried Lutz Maurer

Clint Oteri

Daniel C Edelstein

Heng Wu

John Albrecht Ott

Maryam Ashoori

Young Hoon Kwark

Elham Khabiri

Wilfried Ernst-August Haensch

Suyog Gupta

Warren S Rieutort-Louis

Homa Alemzadeh

Oleg Gluschenkov

Praneet Adusumilli

Oscar Van Der Straten

Paul Alfred Lauro

Cheng-Wei Cheng

Ravi Nair

Oki Gunawan

Jin Cai

Dae-Gyu Park

Robert L Bruce

Yanning Sun

Arjang Hassibi

Christopher Peter D'Emic

Yasir Sulehria

Abdulrahman Albadri

Marinus P J Hopstaken

Choonghyun Lee

Michael Rizzolo

Kenneth Parker Rodbell

Dirk Pfeiffer

Talia S Gershon

Harold John Hovel

Gregory M Fritz

Tsung-Sheng Kang

Wanki Kim

Liying Jiang

Eric Raymond Evarts

Asit Kumar Ray

Virat Vasav Mehta

Davood Shahjerdi

Marinus Pj Hopstaken

Embodiments of the present invention include a phase change memory (PCM) array. The PCM array may include a plurality of PCM cells. Each PCM cell in the plurality of PCM cells may include a top electrode, a resistive element, and a bottom electrode. The PCM array may also include a global heater surrounding the plurality of PCM cells having a thermally conductive material contacting each of the plurality of PCM cells. The global heater may be configured to receive an electric signal to heat the plurality of PCM cells simultaneously.

Global heater for phase change memory

A bottom electrode, a phase change material layer, the phase change material layer includes a similar lattice constant as a lattice constant of the bottom electrode, and a top electrode vertically aligned. A phase change material layer, a top electrode adjacent to a first vertical side surface of the phase change material layer, and a bottom electrode adjacent to a second vertical side surface of the phase change material layer. Forming a phase change material layer, forming a top electrode adjacent to a first vertical side surface and overlapping a first portion of an upper horizontal surface of the phase change material layer, forming a bottom electrode, adjacent to a second vertical side surface and overlapping a second portion of the upper horizontal surface of the phase change material layer, and forming a dielectric material horizontally isolating the bottom electrode and the top electrode.

Crossbar memory array in back end of line

A crystallization seed layer in a substrate, a phase change material layer, the phase change material layer includes a similar lattice constant as a lattice constant of the crystallization seed layer, a top electrode adjacent to a first vertical side surface and a bottom electrode adjacent to a second vertical side surface of the phase change material layer. A plurality of memory structures configured in a crossbar array, each including a crystallization seed layer, a phase change material layer above, a top electrode adjacent to a first vertical side surface and a bottom electrode adjacent to a second vertical side surface of the phase change material layer. A method including forming a crystallization seed layer, forming a phase change material layer, forming a top electrode and a bottom electrode on the substrate, each adjacent to a vertical side surface of the phase change material layer.

Crossbar memory array in back end of line with crystallization front

Embodiments of the invention are directed to a computer-implemented method that includes accessing, using a processor system, a three-dimensional (3D) model of a device-under-design (DUD). The processor system is used to receive a first design operation associated with the 3D model of the DUD. A collaboration dependency model is used to make a prediction of a dependency relationship between the first design operation and a second design operation.

Virtual reality design navigation using a temporal collaboration dependency map

Methods, systems, and a computer program product are disclosed. The first method includes obtaining virtual session data in real time, identifying a positional utterance in the virtual session data, and generating a positional insight for the positional utterance. The first method also includes generating a best-practices recommendation based on the positional insight. The second method includes obtaining virtual session data, identifying positional utterances in the virtual session data, and generating positional insights for each of the positional utterances. The second method also includes selecting each of the positional insights having confidence scores above a threshold score and generating best-practices recommendations based on the selected positional insights.

Contextual positioning in virtual space

Methods, systems, and a computer program product are disclosed. The first method includes obtaining virtual session data in real time, identifying a positional utterance in the virtual session data, and generating a positional insight for the positional utterance. The first method also includes rendering a user avatar in a position recommended based on the positional insight. The second method includes obtaining virtual session data in real time, identifying a positional utterance in the virtual session data, and generating positional insights for the positional utterance. The second method also includes generating at least one position recommendation based on the positional insights.

A Darlington pair sensor is disclosed. The Darlington pair sensor has an amplifying/horizontal bipolar junction transistor (BJT) and a sensing/vertical BJT and can be used as a biosensor. The amplifying bipolar junction transistor (BJT) is horizontally disposed on a substrate. The amplifying BJT has a horizontal emitter, a horizontal base, a horizontal collector, and a common extrinsic base/collector. The common extrinsic base/collector is an extrinsic base for the amplifying BJT. The sensing BJT has a vertical orientation with respect to the amplifying BJT. The sensing BJT has a vertical emitter, a vertical base, an extrinsic vertical base, and the common extrinsic base/collector (in common with the amplifying BJT). The common extrinsic base/collector acts as the sensing BJT collector. The extrinsic vertical base is separated into a left extrinsic vertical base and a right extrinsic vertical base giving the sensing BJT has two separated (dual) bases, a sensing base and a control base. The Darlington pair sensor has high in-situ signal amplification with low noise and uses substrate space effectively.

Darlington pair bipolar junction transistor sensor

A spin-orbit torque (SOT)-MRAM comprising a first magnetic tunneling junction (MTJ) having a first distance and having a first critical voltage. A second MTJ having a second distance and having a second critical voltage, wherein the first distance and the second distance are different, wherein the first critical voltage and the second critical voltages are different. A metal rail in direct contact with the first MTJ and the second MTJ, wherein the metal rail injects a spin current in to both the first MTJ and the second MTJ.

Multi-state SOT-MRAM structure

In an approach to improve the generation of a virtual object in a three-dimensional virtual environment, embodiments of the present invention identify a virtual object to be generated in a three-dimensional virtual environment based on a natural language utterance. Additionally, embodiments generate the virtual object based on a CLIP-guided Generative Latent Space (CLIP-GLS) analysis, and monitor usage of the generated virtual object in the three-dimensional virtual space. Moreover, embodiments infer human perception data from the monitoring, and generate a utility score for the virtual object based on the human perception data.

Optimizing computer-based generation of three-dimensional virtual objects

A circuit structure includes a first ferroelectric field effect transistor (FeFET) having a first gate electrode, a first source electrode, and a first drain electrode and a second FeFET having a second gate electrode, a second source electrode, and a second drain electrode. The first gate electrode is connected to a wordline, and the first source electrode and the second source electrode are connected to a bitline. The first drain electrode is connected to the second gate electrode and the second drain electrode is connected to a bias line. A weight synapse structure is constructed by combining two circuit structures. A plurality of weight synapse structures are incorporated into a crossbar array.

FeFET unit cells for neuromorphic computing

Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a spin transfer torque (STT) magnetoresistive random access memory (MRAM) stack. The semiconductor structure may also include a spin orbit torque (SOT) MRAM stack vertically in series with the STT-MRAM. The SOT-MRAM stack may include a heavy metal spin hall effect rail configured to flip an SOT free-layer magnetic orientation in response to a horizontal signal through the heavy metal rail.

Spin-orbit torque and spin-transfer torque magnetoresistive random-access memory stack

An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

Temperature-assisted device with integrated thin-film heater

A semiconductor structure comprises a gate structure of a transistor. The gate structure comprises a gate conductive portion disposed on a gate dielectric layer. The semiconductor structure further comprises a capacitor structure disposed on the gate structure. The capacitor structure comprises a first conductive layer, a dielectric layer disposed on the first conductive layer and a second conductive layer disposed on the dielectric layer. The first and second conductive layers are respectively connected to a first contact portion and a second contact portion.

Transistor gates having embedded metal-insulator-metal capacitors

A structure including a bottom electrode, a phase change material layer vertically aligned and an ovonic threshold switching layer vertically aligned above the phase change material layer. A structure including a bottom electrode, a phase change material layer and an ovonic threshold switching layer vertically aligned above the phase change material layer, and a first barrier layer physically separating the ovonic threshold switching layer from a top electrode. A method including forming a structure including a liner vertically aligned above a first barrier layer, the first barrier layer vertically aligned above a phase change material layer, the phase change material layer vertically aligned above a bottom electrode, forming a dielectric surrounding the structure, and forming an ovonic threshold switching layer on the first barrier layer, vertical side surfaces of the first buffer layer are vertically aligned with the first buffer layer, the phase change material layer and the bottom electrode.

Phase change memory cell with ovonic threshold switch

A method of forming an electrical device that includes forming a multilayered fin composed of a first source/drain layer for a first transistor, a first channel layer for the first transistor, a common source/drain layer for the first transistor and a second transistor, a second channel layer for the second transistor and a second source/drain layer for the second transistor. A common spacer is formed on the common source/drain layer that separates a first opening to the first channel layer from a second opening to the second channel layer. Gate structures are then formed in the first and second openings.

Series connected stacked vertical transistors for high voltage applications

Growing community of inventors

White Plains, NY, United States of America

Bahman Hekmatshoartabari