Samsung Electronics Co., Ltd.

Baek Kyu Choi

Do Hyung Kim

Jae-jun Lee

Jung-Joon Lee

Seung-Jin Seo

Jeong-Hyeon Cho

Kyoung Sun Kim

Sung Joo Park

A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.

Semiconductor module assembly

A memory module includes a plurality of buses and a plurality of memory chips arranged close to each other along each of the plurality of buses. An N-th memory chip, where N is an integer, of the plurality of memory chips is connected to any one of the plurality of buses, and each of the other memory chips of the plurality of memory chips, except for the N-th memory chip, is connected to the other one of the plurality of buses.

Memory module for improving signal integrity and computer system having the same

Growing community of inventors

Yongin-si, South Korea

Baek Kyu Choi