Samsung Electronics Co., Ltd.

Kyungpook National University Industry-academic Cooperation Foundation

Baehyung Kim

Jong Keun Song

Kyungil Cho

Kyuhong Kim

Youngil Kim

Suhyun Park

Seungheun Lee

Jungho Kim

Sungchan Park

Youngihn Kho

Jooyoung Kang

Yun-Tae Kim

Eunsung Lee

Minseog Choi

Yongrae Roh

Jongkeun Song

Taeho Jeon

An image processing apparatus includes a speckle energy analyzer configured to analyze speckle energy of an ultrasound image signal, the ultrasound image signal being received from an ultrasound probe, and an image decomposer configured to decompose the ultrasound image signal into one or more ultrasound image signals of different frequency bands, based on the analyzed speckle energy of the ultrasound image signal.

Image processing apparatus, control method thereof, and ultrasound imaging apparatus

There are provided an ultrasonic imaging apparatus, an ultrasonic probe apparatus, a signal processing apparatus, and a method for controlling an ultrasonic imaging apparatus. The ultrasonic imaging apparatus may include at least one first ultrasound element installed in a first ultrasound element installation unit; at least one second ultrasound element installed in a second ultrasound element installation unit that is separate from the first ultrasound element installation unit and such that the second ultrasound element forms a gap with the first ultrasound element; and a processor configured to estimate one or two or more virtual ultrasound signals that correspond to the gap based on a first ultrasound signal output from the at least one first ultrasound element and a second ultrasound signal output from the at least one second ultrasound element.

Ultrasonic imaging apparatus, ultrasonic probe apparatus, signal processing apparatus and method of controlling ultrasonic imaging apparatus

An ultrasound imaging apparatus includes an ultrasonic probe configured to transmit an ultrasound to an object, receive an echo signal reflected from the object, and output the echo signal; a quality determiner configured to receive the echo signals and determine quality of voxels of a three-dimensional (3D) volume of the object to be rendered based on observation information of the 3D volume; and a beamformer configured to perform beamforming on the echo signal based on the quality of the voxels to generate an output signal.

Ultrasound imaging apparatus and method for controlling the same

The ultrasonic diagnostic apparatus includes an ultrasonic transducer array in which ultrasonic transducer elements are two-dimensionally arranged; and a controller configured to control the ultrasonic transducer elements to transmit ultrasonic signals and control the ultrasonic transducer elements arranged in rows of the ultrasonic transducer array to sequentially receive ultrasonic echo signals.

Ultrasonic diagnostic apparatus and control method thereof

Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.

Ultrasonic probe

An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.

Ultrasonic probe and manufacturing method thereof

Disclosed herein are an ultrasonic apparatus for imaging an ultrasonic signal and a control method for the same. The ultrasonic apparatus may include a transducer configured to irradiate a plurality of ultrasonic waves which have different traveling directions onto an object and to collect a plurality of echo ultrasonic waves reflected from the object; and a controller configured to acquire a plurality of sound velocities of the plurality of ultrasonic waves in the object and to compound the acquired plurality of sound velocities in order to determine a composite sound velocity in the object.

Ultrasonic apparatus and control method for the same

A beamforming apparatus includes: a signal output unit configured to output signals; a time difference corrector configured to correct a time difference between the signals; and a weight applier configured to apply a weight value to the signals, according to an error between the signals with the corrected time difference and a target delay pattern.

Beamforming apparatus, beamforming method, and ultrasonic imaging apparatus

Disclosed herein are an ultrasound imaging apparatus and a method for controlling the same. An occluded region generated in a 2D image may be removed by performing frame interpolation on a surface region of an object by extracting the surface region of the object from 3D ultrasonic volume data and calculating a motion vector in the extracted surface region, and an amount of calculation may be reduced by calculating a motion vector of the surface region in 3D volume data. The ultrasound imaging apparatus includes a volume data generator configured to acquire volume data which relates to the object, a surface region extractor configured to extract the surface region of the object based on the acquired volume data, and a frame interpolator configured to perform frame interpolation on the extracted surface region of the object.

Growing community of inventors

Yongin-si, South Korea

Baehyung Kim