Electronics and Telecommunications Research Institute

Bae Sun Kim

Yong Ki Son

Ji Eun Kim

Dong Woo Lee

Joon Young Jung

Sung Yong Shin

Hyung Cheol Shin

Il Yeon Cho

Ja Beom Gu

Sung Hee Shin

Disclosed herein are a system and a method for volitional electromyography (vEMG) signal detection from an EMG signal when functional electrical stimulation (FES) is applied. The system for vEMG signal detection includes a receiver for receiving data from an EMG electrode when FES is applied, a memory for storing a program for detecting a vEMG signal using the received data, and a processor for executing the program, wherein the processor cuts the data received from the EMG electrode disposed at a predetermined position, calculates a difference between data for previous FES and data for current FES, and detects the vEMG signal using the calculated difference.

System and method for volitional electromyography signal detection

A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.

Method of manufacturing a fabric type circuit board

Methods for manufacturing a fabric-type circuit board, including: forming a metal plating layer on a base substrate, forming a circuit pattern by etching the metal plating layer, bonding a carrier film on the circuit pattern, and bonding an adhesive film directly below the circuit pattern after removing the base substrate; or bonding an adhesive film to a metal thin film, forming a circuit pattern by etching the metal thin film, and bonding a carrier film on the circuit pattern. In either case, the circuit pattern is transferred to a fabric by bonding the adhesive film to the fabric.

Method for manufacturing fabric type circuit board

Growing community of inventors

Daejeon, South Korea

Bae Sun Kim