Intel Corporation

Babak Sabi

Robert L Sankman

Islam A Salama

Michael J Allen

Stephen Anthony Fischer

Ram S Viswanath

Sri Chaitra Jyotsna Chavali

Kyu-Oh Lee

Richard D Pashley

Joseph D Schutz

Charles H Lucas

David R Gray

Patrick P Gelsinger

Stephen F Sullivan

David J Shield

Gregory K Crain

Stuart T Hopkins

Gustav Laub, Iii

Gustay Laub, Iii

An integrated circuit (IC) structure includes a first IC package (ICP), including a first resist surface provided with a first plurality of conductive contacts (CCs), a first recess including a second resist surface disposed at a bottom of the recess and having a second plurality of CCs, and a second recess, including a third resist surface disposed at a bottom of the recess and provided with a fourth plurality of CCs. The IC structure further includes an IC component with a first surface and a second surface, the second surface having a third plurality of CCs coupled to the second plurality of CCs of the first ICP. The IC structure further includes a second ICP having a first surface and a second surface, with one or more CCs located at the second surface and coupled to at least one of the first plurality of CCs of the first ICP.

Integrated circuit structures with recessed conductive contacts for package on package

Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed.

A CMOS microprocessor chip includes an on-chip single-poly EPROM that is process compatible with the CMOS process used to manufacture the microprocessor. The EPROM is used to store manufacturing and contract related data such as serial number, customer, and process related data such as wafer number test results, binning data, etc. This provides important information for quality and reliability control. The EPROM is also used to control selection of optional microprocessor features such as speed governing, pin-out and I/O bus interface configuration. A third use is for trimming of critical circuit elements and for cache redundancy fault control.

Microprocessor having single poly-silicon EPROM memory for programmably

A CMOS microprocessor chip includes an on-chip single-poly EPROM that is process-compatible with the CMOS process used to manufacture the microprocessor. The EPROM is used to store manufacturing and contract related data such as serial number, customer, and process related data such as wafer number test results, binning data, etc. This provides important information for quality and reliability control. The EPROM is also used to control selection of optional microprocessor features such as speed governing, pin-out and I/O bus interface configuration. A third use is for trimming of critical circuit elements and for cache redundancy fault control.

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Hillsboro, OR, United States of America

Babak Sabi