Jabil Inc.

Babak Naderi

Jeroen Bosboom

Tatiana Pankova Major

Richard Munro

George Kovatchev

Kwok Yu

Payman Rahimi

Ward Palmer

Michael McKenney

Jose Luna

Jeffrey Villegas

Lucas Nielsen

Michael Patrick Mckenney

Kwok Kuen Yu

The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Apparatus, system and method for providing an end effector

An apparatus, system and method for providing an automated contact cutter. The contact cutter includes a contact reel holder for holding therein a bandoleer comprising a plurality of stamped contacts; at least an inlet roller comprising an inlet pin, a turn roller, and a receiving roller mechanically connected by at least one motor drive belt to a drive motor, wherein the inlet roller is capable of receiving an end portion of the bandoleer onto the inlet pin for loading; a cutter between the turn roller and the receiving roller that is capable of cutting ones of the stamped contacts from the bandoleer for picking by a pick and place robot; and a comb capable of combing at least the bandoleer and cut and partially cut ones of the stamped contacts.

Apparatus, system and method for cutting and delivering stamped contacts

The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics. The apparatus, system and method of providing at least a planar alignment of at least one component or device in relation to a secondary reference plane may include at least: a frame and stator assembly, having, at an upper portion thereof, at least a semi-spherical receiving interface; a movable assembly that moves within the frame and stator assembly, and that is connectively associated therewith by at least a plurality of springs; a semi-spherical stage, suitable for reception by the semi-spherical receiving interface and capable of at least rotational movement therewithin; a chuck within the semi-spherical stage and capable of at least co-planar, post-planar, and ante-planar positioning in relation to a plane provided by a topmost portion of the semispherical stage, wherein the chuck is capable of receiving the component or device; and at least two gripper jaws suitable for receiving and holding, at an upper portion thereof, the component or device, wherein the two gripper jaws comprise, at a lower portion thereof, at least ramps capable of physically interacting with ones of the motion stops.

Apparatus, system and method for an air bearing stage for component or devices

An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.

Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner

Growing community of inventors

St. Petersburg, FL, United States of America

Babak Naderi