Cypress Semiconductor Corporation

Invensense, Inc.

Intel Corporation

Integrated Biosensing Technologies

Other

Redwood Microsystems, Inc.

Cypress Semiconductor Corpoartion

Babak A Taheri

Steven Saeed Nasiri

Sanjeev K Maheshwari

Joseph Seeger

David Sachs

Goksen G Yaralioglu

Greg J Richmond

Steve Whelan

Gopal Patil

Errol B Arkilic

Fredrick B Jenne

James M Harris

Thurman John Rodgers

Dan Zupcau

Michael J Selser

A system and method are provided to monitor, store and communicate data on parameters of a consumable product stored in a sealed container. In one embodiment, the method includes hermetically sealing the product in the container, and packaging the container for sale to a consumer. Packaging includes attaching a system to the container to monitor and store in the memory data on parameters of the consumable product. Attaching the system includes affixing a flexible substrate including a laser-detector pair directly to an outer surface of the container. The laser-detector pair is configured to pass laser light through the container to reflect from a reflector affixed to the outer surface of the container opposite the laser-detector pair to non-invasively sense parameters of the consumable product. The method further includes providing an interrogator to the consumer to communicate with the system to access the data.

System and method to monitor and report condition of a consumable product

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.

MEMS rotation sensor with integrated electronics

Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.

Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics

Methods of fabricating a Micro-Electromechanical System (MEMS) in a hermetically sealed cavity formed at a substrate level are provided. Generally, the method comprises: (i) forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; (ii) forming an actuator/sensor layer including a number of MEMS devices with electrically conductive regions therein; (iii) bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a sealed cavity around the MEMS; and (iv) electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. Other embodiments are also described.

Wafer level structures and methods for fabricating and packaging MEMS

A method of measuring the temperature of device under test includes the steps of injecting a first current into an on-chip diode wherein a die containing the on-chip diode is under test. A second current is injected into the on-chip diode. A junction temperature is calculated based on the first current and the second current.

System and method for measuring the temperature of a device

Optimizing a circuit by calculating at least one parameter of a circuit based on a first size of at least one sleep transistor, calculating at least one parameter of the logic circuit based on a second size of the at least one sleep transistor. This process may be repeated for different sizes of the at least one sleep transistor to determine an optimum size of the at least one sleep transistor to optimize at least one parameter of the logic circuit.

Method of circuit optimization utilizing programmable sleep transistors

An improved ESD protection device, integrated circuit and method for programmably altering a sensitivity of the ESD protection device is provided herein. More specifically, an active shunt ESD protection device is provided with an improved trigger circuit design. The improved trigger circuit design enables the sensitivity of the ESD protection device to be altered by providing a variety of programmable elements for adjusting an RC time constant of a slew rate detector contained therein. The programmable elements allow the RC time constant to be altered at the wafer or package level, and avoid the significant time and cost typically associated with conventional trial-and-error adjustment procedures.

Programmable electrostatic discharge (ESD) protection device

An oscillator circuit is provided having an oscillating amplifier circuit connected to a resonator. The oscillator/amplifier and resonator are preferably fabricated on a single die using semiconductor fabrication tools. Included with the circuitry is a temperature sensor or transducer, an execution unit, non-volatile memory, a modulator, and frequency synthesizer, all of which are integrated together on the substrate, along with the piezoelectric crystal resonator. The frequency synthesizer can preferably include a phase-locked loop with a divider that is in a feedback loop of the phase-locked loop, in which a divide-by value is received from a modulator that achieves finer and higher resolution frequency selectivity from the voltage-controlled oscillator, also within the phase-locked loop, as an output from the crystal oscillator.

Resonator and amplifying oscillator circuit having a high resolution skew-compensated frequency synthesizer integrated on a single substrate

A one-time programmable (OTP) latch circuit can include a single OTP device capable of storing a logic value in a nonvolatile fashion, or only two OTP devices in the event redundancy is desired. A latch section can latch a data value based on a comparison between a current drawn according to the one OTP device, and a reference current generated without and OTP device. An OTP device can include a gate oxide antifuse (GOAF) device.

One time programmable latch and method

Circuits for regulating a voltage or current to a load(s). In one example, a circuit may include a first amplifier providing an amplifier output signal, the first amplifier having at least a first input and a second input, the first input receiving a voltage reference signal; a first transistor receiving the amplifier output signal, the first transistor having a transistor output; at least one resistor coupled between the transistor output and the second input of the first amplifier and defining a feedback voltage signal node; a second transistor in parallel with the first transistor, the second transistor receiving the amplifier output signal, the second transistor providing a regulated output signal of the circuit; a second amplifier receiving the output signal of the second transistor and the transistor output of the first transistor, the second amplifier providing a control signal; and a circuit element coupled between the feedback voltage signal node and ground, the circuit element receiving as a control the control signal of the second amplifier.

Growing community of inventors

San Francisco, CA, United States of America

Babak A Taheri