Spectrolab, Inc.

B Terence Cavicchi

Gregory S Glenn

Dmitri D Krut

Denise E Michaels

Thin semiconductor devices, such as thin solar cells, and a method of fabricating same are disclosed. A microblasting procedure is employed to thin a semiconductor wafer or substrate, such as a solar cell wafer, wherein fine abrasive particles are used to etch away wafer material through a mask. Thick areas remain at the perimeter of the semiconductor device or solar cell, in regions of the semiconductor device or solar cell behind the front interconnect attachment pads, and at corresponding rear interconnect attachment areas. In addition, there are thick areas in a pattern that comprise interconnected beams that support the thin wafer areas. Consequently, predetermined areas of the wafer are thinned to form a predetermined structural pattern in the wafer that includes an external frame and a plurality of interconnected beams. The final configuration of the semiconductor device or solar cell has approximately 20% of the area at the original wafer thickness with the remaining 80% etched away to a relatively thin thickness.

Method of fabrication of thin semiconductor device

A photovoltaic microarray such as a solar cell array is monolithically fabricated, without a supporting substrate, by forming a network of trenches from one side of a substrate to define separate cell areas, filling the trenches with an insulative filler material that adheres to the substrate material and provides structural integrity, and then trenching from the opposite side of the substrate to provide an air gap insulation network between adjacent cells. Series connections are provided between adjacent cells by connecting the front surface of one cell over the filler material to the bulk semiconductor for the next cell, with the connection completed through the bulk semiconductor itself to back electrodes for each cell.

Growing community of inventors

North Hollywood, CA, United States of America

B Terence Cavicchi