Ngk Insulators, Inc.

Toppan Printing Co., Ltd.

Azuma Yamamoto

Yukihisa Takeuchi

Akira Takahashi

Tetsuo Watanabe

Takuya Hiramatsu

Kazuo Shirakawa

Takao Segawa

Kenji Suzuki

Toshiki Goto

Susumu Hama

The present invention provies an adsorbent which, as compared with an adsorbent comprising a zeolite (an aluminosilicate) of at least about equal Si/(Fe&plus;Al) molar ratio (Fe is substantially absent), has high heat resistance and high hydrothermal resistance and can maintain adsorption capability even when exposed to high temperatures. This adsorbent comprises a &bgr;-silicate molecular sieve containing at least Fe besides H, O and Si and, when Al is contained, containing Fe in a molar amount at least equal to that of Al.

&bgr;-zeolite molecular sieve absorbent

A process for synthesizing a high-silica aluminosilicate molecular sieve, includes: subjecting, to hydrothermal synthesis, a raw material containing Al, H, O and Si and, as other elements, at least Fe and having a Si/Al molar ratio of 50 or more and a Si/Fe molar ratio of 80 or less (45 or less when a high-silica aluminosilicate molecular sieve having a .beta. type zeolite structure is produced) and then subjecting the resulting material to heat treatment in an oxidizing atmosphere at 300.degree. C. or more. The above process can synthesize a high-silica zeolite low in Al content directly without dealumination operation, and can provide process simplification and a higher yield.

Process for synthesis of high-silica silicate molecular sieve

A plated ceramic or glass substrate having a plated surface, wherein an undercoat is formed between the surface of the substrate and the plating film. The undercoat includes nitrogen and at least one of chromium and titanium as major components thereof.

Plated ceramic or glass substrate having undercoat

A patterned structure including a plurality of patterned sheet members which have respective configurations and which are partially superposed on each other and which cooperate with each other to define a plurality of voids. At least one of the sheet members includes a thin-walled portion whose thickness is smaller than a thickness of the other portion. The thin-walled portion is formed by etching the appropriate sheet member or members. The thin-walled portion of one sheet member engages the corresponding thin-walled portion or the other portion of the other sheet member or members.

Method of producing a minutely patterned structure

Minutely patterned structure

A recording head capable of applying an electric current, including an array of recording electrodes in the form of strips which are substantially equally spaced apart from each other in a direction perpendicular to lengths of the strips, by a distance smaller than the thickness of said strips. The strips include at least parts of generally elongate electrode portions of electrically conductive sheets superposed on each other in a predetermined relative position into an electrode assembly. The elongate electrode portions of each electrically conductive sheet is defined by a plurality of apertures whose width is larger than the thickness of each electrically conductive sheet. The elongate electrode portions of electrically conductive sheets cooperate with each other to define a plurality of slits whose width is smaller than the thickness of the sheet. The electrode portions of the electrode assembly functioning as the strips are spaced apart from each other by the width of the slits.

Growing community of inventors

Nagoya, Japan

Azuma Yamamoto