Freescale Semiconductor,inc.

Azhar Aripin

Wai Yew Lo

Kong Bee Tiu

Norsaidi Sariyo

A leadframe () for a semiconductor device has a radially extending leads () having inner lead portions () and outer lead portions (), and a dam bar () that mechanically connects the leads () together near the outer lead portions (). The inner lead portions () define an open area having a central region and the dam bar () defines a leadframe outer perimeter. A generally X-shaped die support member has arms () that extend from the leadframe outer perimeter and meet at the central region. A heat sink includes sections () that are formed between adjacent pairs of the die support member arms (). The heat sink sections () are connected to the die support member arms () with down set tie bars () such that the heat sink lays in a plane below a plane of the die support member arms ().

Leadframe for a semiconductor device

A stacked multichip package () has a base carrier () having a top side () and a bottom side (), a bottom integrated circuit die () having a bottom surface () attached to the base carrier top side (), and an opposing, top surface (). The top surface () has a peripheral area including a plurality of first bonding pads and a central area (). A bead () is formed on the top surface () of the bottom die () between the peripheral area and the central area (). A top integrated circuit die () having a bottom surface is positioned over the bottom die () and the bottom surface of the top die () is attached to the top surface () of the bottom die () via the bead (). The bead () maintains a predetermined spacing between the bottom die () and the top die () so that wirebonds of first wires () connecting the bottom die () to the base carrier () are not damaged when the top die () is attached to the bottom die ().

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Selangor, Malaysia

Azhar Aripin