Texas Instruments Corporation

Ayumu Kuroda

Benjamin Stassen Cook

Kurt Peter Wachtler

Brian Goodlin

Stuart M Jacobsen

Genki Yano

Makoto Yoshino

Karen Kirmse

Makoto Shibuya

Kengo Aoya

Brian E Goodlin

An electronic package includes an electronic component including terminals, a plurality of surface contacts, at least some of the surface contacts being electrically coupled to the terminals within the electronic package, a mold compound covering the electronic component and partially covering the surface contacts with a bottom surface exposed from the mold compound, and a plurality of wires extending from exposed surfaces of the surface contacts, each of the wires providing a solderable surface for mounting the electronic package at a standoff on an external board.

Electronic package with surface contact wire extensions

A packaged micro-electro-mechanical system (MEMS) device () comprises a circuitry chip () attached to the pad () of a substrate with leads (), and a MEMS () vertically attached to the chip surface by a layer () of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring () with a surface phobic to silicone compounds. A dome-shaped glob () of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package () of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Growing community of inventors

Beppu Oita-Ken, Japan

Ayumu Kuroda