Samsung Electronics Co., Ltd.

Amorepacific Corporation

Yonsei University

Ayoung Kim

Byungwook Kim

Yong-Deog Hong

Sangsu Ha

Si Young Cho

Juewon Kim

Hyungsu Kim

Seongwon Jeong

Hyun Woo Jeong

Jeong-kee Kim

Suk Jin Ko

Ji Hyun Jeong

Ji Woong Ahn

Seung Soo Chung

Haeseong Jeong

Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

Package substrate and semiconductor package including the same

A semiconductor chip includes a back end of line (BEOL) structure on a first surface of the semiconductor substrate and including a conductive connection structure and an interlayer insulating layer covering the conductive connection structure, a conductive reinforcing layer arranged on the BEOL structure, a cover insulating layer covering the conductive reinforcing layer, an under bump metal (UBM) layer including a plurality of pad connection portions connected to the conductive reinforcing layer through openings in the cover insulating layer, and a plurality of first connection bumps arranged on the plurality of pad connection portions of the UBM layer, electrically connected to one another through the conductive reinforcing layer, and located to overlap the conductive reinforcing layer. The conductive reinforcing layer has a plate shape and extends parallel to the first surface of the semiconductor substrate.

Interconnect structure and semiconductor chip including the same

The present specification relates to a composition containing a tea extract with an increased specific ingredient content for prevention or alleviation of lipid metabolism disorders. The use of a preparation method and a composition according to the present specification can effectively prevent and treat lipid metabolism disorders including obesity without side effects, thereby meeting related demands and promoting the development of corresponding industries.

Method for preventing or alleviating lipid metabolism disorders using composition containing green tea extract with increased specific ingredient content

Disclosed is to provide a composition which is derived from a natural product and exhibits an excellent effect of protecting cells from oxidative stress and a method for preparing the same. The extract and composition according to one aspect of the present disclosure are derived from a natural product, thus are safe. It can prevent, ameliorate and treat oxidative stress and neuron damage. Therefore, it allows to improve the quality of life of the elderly population without concerns about side effects and promote development of the related industry.

Composition for protecting cell from oxidative stress comprising green tea extract which has modified amounts of ingredients

Disclosed is to provide a composition derived from a natural material and which has an excellent effect of enhancing cognitive function and a method for preparing the same. The extract and composition according to one aspect of the present disclosure are derived from a natural material and thus are safe. It can prevent, ameliorate and treat cognitive decline. Therefore, it allows to improve the quality of life of the elderly population without concerns about side effects and promote development of the related industry.

Composition for enhancing cognitive function comprising green tea extract which has modified amounts of ingredients

Growing community of inventors

Yongin-si, South Korea

Ayoung Kim