Applied Materials, Inc.

University of Texas System

Zoll Circulation, Incorporated

Ayan Majumdar

Sushant Suresh Koshti

Edward Ng

Jeffrey C Hudgens

Nir Merry

Dean C Hruzek

Douglas Brian Baumgarten

Helder T Lee

Sanjay Rajaram

John C Menk

Sangram Patil

John Joseph Mazzocco

Douglas MacLeod

David Phillips

Eric Andrew Englhardt

Jeremy Thomas Dabrowiak

Travis Morey

Sean W Yip

Daniel A Greenberg

Haiying Huang

Steve S Hongkham

John William Jacobsen

Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Substrate processing systems, apparatus, and methods with factory interface environmental controls

Devices, systems and methods for controlling a patient's body temperature by endovascular heat exchange and/or surface heat exchange.

Devices, systems and methods for endovascular temperature control

A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Carrier adapter insert apparatus and carrier adapter insert detection methods

In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.

Methods and systems for improved mask processing

Methods, apparatus, and assemblies are provided for an adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Transfer chamber gas purge apparatus, electronic device processing systems, and purge methods

Systems, apparatus and methods including pneumatic end effectors for transporting substrates between system components of electronic device manufacturing systems are provided. In one aspect, an end effector has a base adapted to be connected to a robotic component, and one or more pneumatic suction elements positioned on the base. Applying a pneumatic source to the pneumatic suction element draws a substrate into contact with contact pads of the end effector. Methods and systems, as well as numerous other aspects are disclosed.

Pneumatic end effector apparatus and substrate transportation systems with annular flow channel

An optical fiber based polymer core sensor includes an optical fiber having a core and an end having a cured polymer core affixed to the core of the optical fiber. The cured polymer core extends outward from the end of the optical fiber and has a diameter approximately equal to the core of the optical fiber. Note the cured polymer core can be substantially cylindrical, tapered or geometrically shaped. The optical fiber based polymer core sensor can be used to measure a temperature, measure a strain, measure a distance, measure a refractive index, detect or measure an analyte, detect a toxin, detect a biological agent, monitor a chemical process, or a combination thereof.

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San Jose, CA, United States of America

Ayan Majumdar